MC9S08DN32AMLC vs MC9S08JM60CLH 对比

详细并排对比 MC9S08DN32AMLC 出自 NXP Semiconductors 和 MC9S08JM60CLH 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S08DN32AMLC MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC Nrnd
NXP Semiconductors
MC9S08JM60CLH MC9S08JM60CLH - 8-bit USB MCU 60KB Flash 48MHz 64-LQFP | NXP

MC9S08JM60CLH - 8-bit USB MCU 60KB Flash 48MHz 64-LQFP | NXP

MC9S08JM60CLH ✓ 量产中

规格对比

参数 MC9S08DN32AMLC MC9S08JM60CLH
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $3.98 $5.05
Core HCS08 (S08) HCS08 (S08) 8-bit CISC
Instruction Set HC08 with BGND HC08 + BGND
CPU Frequency 40 MHz 48 MHz (24 MHz internal bus)
Bus Frequency 20 MHz —
Program Memory (Flash) 32 KB (32K x 8) —
RAM 1.5 KB (1.5K x 8) 4 KB
EEPROM Embedded —
Number of I/O 25 —
ADC 12-bit, up to 16 channels, 2.5 us conversion [DATA_NEEDED: ADC resolution and channel count]
CAN (MSCAN) CAN 2.0 A/B —
Serial Interfaces SCI (UART), SPI, I2C —
封装 32-LQFP (7x7 mm) 64-LQFP (10x10 mm)
工作温度 -40 C to +125 C -40C to +85C
电源电压 [DATA_NEEDED: VDD range] 2.7 V to 5.5 V
安装类型 Surface Mount Surface Mount
Packaging Tray —
RoHS 状态 Compliant Compliant
Oscillator Type External —
Debug Interface Background Debug Mode (BDM) Background Debug System (BDS) + ICE debug module with 2 comparators and 9 trigger modes
Program Flash — 60 KB
USB — USB 2.0 full-speed device + on-chip transceiver
GPIO (max) — 51
Timers — [DATA_NEEDED: timer module count]
Communication Interfaces — USB 2.0 FS, I2C, SPI, UART (up to 2)
MSL 等级 — [DATA_NEEDED: MSL rating]
Tray Standard Qty — Tray

数据手册与资源

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