MC9S08DN60ACLH vs MC9S08DV60AMLH Comparison

Detailed side-by-side comparison of MC9S08DN60ACLH by NXP Semiconductors and MC9S08DV60AMLH by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd
NXP Semiconductors
MC9S08DV60AMLH MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP

MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP

MC9S08DV60AMLH ✓ Active

Specification Comparison

Parameter MC9S08DN60ACLH MC9S08DV60AMLH
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Active
Stock Status In Stock In Stock
Unit Price (USD) $5.21 $3.85
Core HCS08 (S08 core) —
Data Bus Width 8 bit —
CPU Frequency 40 MHz —
Bus Frequency 20 MHz —
Program Memory (Flash) 60 KB (60K x 8) —
RAM Size 2 KB (2K x 8) 3K x 8
EEPROM Embedded (size [DATA_NEEDED: EEPROM size]) —
Number of I/O 53 53
Package / Case 64-LQFP (10x10 mm) 64-LQFP (10x10 mm)
Mounting Type Surface Mount Surface Mount
ADC 16-channel, 12-bit, 2.5 us conversion —
Communication Interfaces CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C —
Oscillator Type External External
Interrupt Sources Up to 32 —
Operating Temperature -40C to +85C [DATA_NEEDED: confirm automotive grade range] —
Packaging Tray Tray
RoHS Status Compliant —
Instruction Set HC08 + BGND instruction HC08 with added BGND instruction
On-Chip Debug BDM (Background Debug Mode) —
Core Processor — S08 (HCS08), 8-bit
Core Size — 8-Bit
Speed — 40MHz CPU (20MHz bus)
Program Memory Size — 60KB (60K x 8)
Program Memory Type — FLASH
Input-Only Pins — 1
ADC Resolution — 12-bit
ADC Channels — 16
ADC Conversion Time — 2.5 us
Connectivity — CAN (MSCAN), LIN master
Interrupt/Reset Sources — Up to 32
Supply Voltage — 3.3V/5V

Datasheets & Resources

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