MC9S08DN60ACLH vs MC9S08DV60AMLH Vergleich
Detaillierter Direktvergleich von MC9S08DN60ACLH von NXP Semiconductors und MC9S08DV60AMLH von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DN60ACLH | MC9S08DV60AMLH |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5,21 | $3,85 |
| Core | HCS08 (S08 core) | — |
| Datenbusbreite | 8 bit | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM Size | 2 KB (2K x 8) | 3K x 8 |
| EEPROM | Embedded (size [DATA_NEEDED: EEPROM size]) | — |
| Number of I/O | 53 | 53 |
| Gehäuse / Bauform | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) |
| Montageart | Surface Mount | Surface Mount |
| ADC | 16-channel, 12-bit, 2.5 us conversion | — |
| Communication Interfaces | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C | — |
| Oscillator Type | External | External |
| Interrupt Sources | Up to 32 | — |
| Betriebstemperatur | -40C to +85C [DATA_NEEDED: confirm automotive grade range] | — |
| Packaging | Tray | Tray |
| RoHS-Status | Compliant | — |
| Instruction Set | HC08 + BGND instruction | HC08 with added BGND instruction |
| On-Chip Debug | BDM (Background Debug Mode) | — |
| Core Processor | — | S08 (HCS08), 8-bit |
| Core Size | — | 8-Bit |
| Speed | — | 40MHz CPU (20MHz bus) |
| Program Memory Size | — | 60KB (60K x 8) |
| Program Memory Type | — | FLASH |
| Input-Only Pins | — | 1 |
| ADC Resolution | — | 12-bit |
| ADC Channels | — | 16 |
| ADC Conversion Time | — | 2.5 us |
| Connectivity | — | CAN (MSCAN), LIN master |
| Interrupt/Reset Sources | — | Up to 32 |
| Versorgungsspannung | — | 3.3V/5V |