MC9S08DN60MLF vs MC9S08AW60CFUE Comparison
Detailed side-by-side comparison of MC9S08DN60MLF by NXP Semiconductors and MC9S08AW60CFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S08DN60MLF - 40MHz 8-Bit 60KB MCU | NXP
MC9S08DN60MLF [data_needed: lifecycle status]
Specification Comparison
| Parameter | MC9S08DN60MLF | MC9S08AW60CFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | [DATA NEEDED: Lifecycle Status] | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $8.10 |
| Product Type | 8-bit HCS08 embedded microcontroller | 8-bit HCS08 microcontroller |
| Program Memory Size | 60 KB (60K x 8) flash | — |
| RAM Size | 2 KB (2K x 8) | — |
| CPU Speed | 40 MHz | — |
| Bus Speed | 20 MHz | — |
| Architecture | HCS08 CPU with HC08 instruction set and BGND instruction | — |
| Number of I/O | 39 | — |
| ADC Channels | 16 channels | — |
| ADC Resolution | 12-bit | — |
| ADC Conversion Time | 2.5 microseconds | — |
| Oscillator Type | External oscillator | — |
| Interrupt/Reset Sources | Up to 32 interrupt/reset sources | — |
| Package | 48-LQFP (7x7 mm) | 64-QFP, 14 x 14 mm |
| Mounting Type | Surface-mount gull-wing package | — |
| Temperature Grade | Automotive | — |
| Packaging | Tray | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| CAN Controller | No CAN | — |
| Flash Read/Program/Erase | Supported over full operating voltage and temperature | — |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| RAM | — | 4 KB |
| Core | — | Enhanced HCS08 8-bit core |
| Supply Voltage | — | 2.7 V to 5.5 V |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Height | — | 1 mm |
| Package Pitch | — | 0.50 mm |
| Mounting Style | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Debug Interface | — | Single-wire background debug mode interface |
| Application Support | — | Industrial and automotive |
| Lifecycle Status | — | NRND |
| Supplier Reference | — | NXP USA Inc. |