MC9S08DN60MLF vs MC9S08AW60CFUE Сравнение
Подробное сравнение бок о бок MC9S08DN60MLF от NXP Semiconductors и MC9S08AW60CFUE от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MC9S08DN60MLF - 40MHz 8-Bit 60KB MCU | NXP
MC9S08DN60MLF [data_needed: lifecycle status]
Сравнение характеристик
| Параметр | MC9S08DN60MLF | MC9S08AW60CFUE |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | [DATA NEEDED: Lifecycle Status] | NRND |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $0,00 | $8,10 |
| Product Type | 8-bit HCS08 embedded microcontroller | 8-bit HCS08 microcontroller |
| Program Memory Size | 60 KB (60K x 8) flash | — |
| RAM Size | 2 KB (2K x 8) | — |
| CPU Speed | 40 MHz | — |
| Bus Speed | 20 MHz | — |
| Architecture | HCS08 CPU with HC08 instruction set and BGND instruction | — |
| Number of I/O | 39 | — |
| ADC Channels | 16 channels | — |
| ADC Resolution | 12-bit | — |
| ADC Conversion Time | 2.5 microseconds | — |
| Oscillator Type | External oscillator | — |
| Interrupt/Reset Sources | Up to 32 interrupt/reset sources | — |
| Корпус | 48-LQFP (7x7 mm) | 64-QFP, 14 x 14 mm |
| Тип монтажа | Surface-mount gull-wing package | — |
| Temperature Grade | Automotive | — |
| Packaging | Tray | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| CAN Controller | No CAN | — |
| Flash Read/Program/Erase | Supported over full operating voltage and temperature | — |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| RAM | — | 4 KB |
| Core | — | Enhanced HCS08 8-bit core |
| Напряжение питания | — | 2.7 V to 5.5 V |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Height | — | 1 mm |
| Package Pitch | — | 0.50 mm |
| Способ монтажа | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Debug Interface | — | Single-wire background debug mode interface |
| Application Support | — | Industrial and automotive |
| Статус жизненного цикла | — | NRND |
| Supplier Reference | — | NXP USA Inc. |