MC9S08DV128CLH vs MC9S08DN60ACLH Comparison

Detailed side-by-side comparison of MC9S08DV128CLH by NXP Semiconductors and MC9S08DN60ACLH by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08DV128CLH MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP

MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP

MC9S08DV128CLH ✓ Active
NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd

Specification Comparison

Parameter MC9S08DV128CLH MC9S08DN60ACLH
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active NRND
Stock Status In Stock In Stock
Unit Price (USD) $4.42 $5.21
Core Architecture HCS08 (enhanced S08 core) —
Data Bus Width 8-bit 8 bit
CPU Frequency 40 MHz 40 MHz
Internal Bus Frequency 20 MHz —
Program Memory Size 128 KB (128K x 8) Flash —
RAM Size 6 KB (6K x 8) 2 KB (2K x 8)
Number of I/O Pins 53 —
Package 64-LQFP (10x10 mm) —
Mounting Type Surface Mount Surface Mount
Oscillator Type External External
Operating Supply Voltage [DATA_NEEDED: Vdd range] —
Operating Temperature Range [DATA_NEEDED: temperature grade] —
Instruction Set HC08 with BGND addition HC08 + BGND instruction
Interrupt Sources Up to 32 Up to 32
Integrated CAN Module Yes (CAN 2.0) —
Packaging Tray Tray
RoHS Status Compliant Compliant
Core — HCS08 (S08 core)
Bus Frequency — 20 MHz
Program Memory (Flash) — 60 KB (60K x 8)
EEPROM — Embedded (size [DATA_NEEDED: EEPROM size])
Number of I/O — 53
Package / Case — 64-LQFP (10x10 mm)
ADC — 16-channel, 12-bit, 2.5 us conversion
Communication Interfaces — CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C
Operating Temperature — -40C to +85C [DATA_NEEDED: confirm automotive grade range]
On-Chip Debug — BDM (Background Debug Mode)

Datasheets & Resources

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