MC9S08DZ32AMLH vs MC9S08DZ32ACLH Comparison

Detailed side-by-side comparison of MC9S08DZ32AMLH by NXP Semiconductors and MC9S08DZ32ACLH by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08DZ32AMLH MC9S08DZ32AMLH - 8-bit S08 MCU 32KB Flash CAN 40MHz | NXP

MC9S08DZ32AMLH - 8-bit S08 MCU 32KB Flash CAN 40MHz | NXP

MC9S08DZ32AMLH Nrnd

Specification Comparison

Parameter MC9S08DZ32AMLH MC9S08DZ32ACLH
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $5.32
Core Processor HCS08 (S08 core) —
Core Size 8-Bit —
Instruction Set HC08 with added BGND instruction (CISC) HC08 with BGND extension
Maximum CPU Frequency 40 MHz —
Bus Frequency 20 MHz —
Program Memory Size 32KB (32K x 8) FLASH 32 KB Flash
Supply Voltage 3.3V / 5V —
ADC Resolution 12 bit —
ADC Channels 24-channel —
ADC Conversion Time 2.5 us —
CAN Module Yes (embedded CAN, MSCAN) —
EEPROM Embedded EEPROM —
Interrupt/Reset Sources Up to 32 —
Debug Interface On-chip emulation/debug (background debug, BGND) —
Package 64-LQFP (10x10 mm) 64-LQFP (10x10 mm)
Mounting Type Surface Mount Surface Mount
Packaging Tray —
Series S08DZ (S08 Family, S08D Series) —
Product Category Microcontrollers (MCU) —
Lifecycle Status NRND (Not Recommended for New Designs) —
Core — HCS08 (enhanced S08)
Data Bus Width — 8 bit
Maximum Clock Frequency — 40 MHz (CPU); 20 MHz bus
RAM Size — 2 KB
Supply Voltage Range — 2.7 V to 5.5 V
Operating Temperature Range — -40 C to +85 C
Connectivity — CANbus, I2C, LINbus, SCI, SPI
Peripherals — LCD driver, ADC, PWM, TIM, BDM
Number of I/Os — 54 (typical, varies by peripheral allocation)
MSL Level — 3 (168 Hours)
RoHS Status — Compliant
On-chip Debug — Background Debug Mode (BDM)

Datasheets & Resources

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