NXP Semiconductors

MC9S08DZ32ACLH - 8-bit 40MHz 32KB Flash CAN MCU | NXP | LQFP-64

MPN: MC9S08DZ32ACLH ✗ End of Life
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2.7 V to 5.5 V Vdss 64-LQFP (10x10 mm) Package 40 MHz (CPU); 20 MHz bus Speed 32 KB Flash Memory
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Price updated: 2026-10-18
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10 $7.62 $76.20
100 $6.45 $645.00
500 $5.81 $2,905.00
1,000 $5.32 $5,320.00
ℹ️ All prices are in USD

MC9S08DZ32ACLH Overview

The NXP MC9S08DZ32ACLH is an 8-bit HCS08-family microcontroller with 32KB Flash, 2KB RAM, and integrated CAN/LIN connectivity, housed in a 64-pin LQFP (10x10 mm) package. The device runs at 40MHz internal CPU frequency (20MHz bus) over a wide 2.7V-5.5V supply range, targeting feature-dense automotive body, industrial CAN-node, and white-goods applications.

What is an 8-bit MCU with embedded CAN? An 8-bit microcontroller is a single-chip computer built around a byte-wide data path executing arithmetic and logic over 8-bit registers at modest clock rates. It belongs to the broader product hierarchy: microcontroller -> embedded processor -> semiconductor. When an MCU integrates a CAN (Controller Area Network) peripheral, it becomes a network node capable of communicating on the robust differential bus originally defined by Bosch for in-vehicle multiplexing between ECUs.

Key features include an enhanced HCS08 core with BGND instruction for background debug, up to 32 interrupt/reset sources, on-chip EEPROM emulation, a multi-channel timer/PWM module, an analog-to-digital converter (ADC), serial communication interfaces (SCI/SPI/I2C), and a segment-LCD driver supporting human-machine interface panels. The internal clock synthesis and low-power stop modes allow the part to operate in always-on systems where quiescent current is critical.

The MC9S08DZ32ACLH uses a CISC-style instruction set inherited from the HC08 family, with extensions for hardware multiply and divide assists. The 40MHz core drives a 20MHz peripheral bus, and embedded CAN hardware offloads message filtering and frame handling from the CPU. 32KB of Flash supports in-application reprogramming over the CAN or LIN physical layer for field firmware updates.

Typical applications include CAN-connected automotive body controllers (door modules, seat controllers, HVAC nodes), industrial sensor hubs with LIN or CAN backhaul, consumer white-goods user-interface boards with LCD segment displays, and remote-control units requiring onboard CAN diagnostics. Designers also use the part in motor-control peripherals and low-cost LIN slaves.

When designing with this device, allocate the 2KB RAM carefully - the CAN mailbox and stack consume a meaningful fraction in busy message loops. Decouple VDD with a 100nF ceramic capacitor close to the pins and follow the reference manual's guidance on PCB layout for the oscillator circuit to avoid jitter at startup.

Drop-in alternatives for MC9S08DZ32ACLH — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S08DZ32ACLH (same form factor and footprint) — differing in Instruction Set, Program Memory Size, Supply Voltage, Package, EEPROM.

NXP Semiconductors
Instruction Set: HC08 with BGND addition
Program Memory Size: 128 KB (128K x 8) Flash
Compare with MC9S08DZ32ACLH →
NXP Semiconductors
Instruction Set: HC08 with added BGND instruction
Program Memory Size: 32 KB (32K x 8) Flash
Supply Voltage: 3.3 V / 5 V
Compare with MC9S08DZ32ACLH →
NXP Semiconductors
Instruction Set: HC08 with added BGND instruction (CISC)
Program Memory Size: 32KB (32K x 8) FLASH
Supply Voltage: 3.3V / 5V
Compare with MC9S08DZ32ACLH →
NXP Semiconductors
Supply Voltage: 2.7 V to 5.5 V
EEPROM: 2 KB
Compare with MC9S08DZ32ACLH →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S08DZ60ACLC

✅ Drop-In
📦 64-LQFP
60 KB Flash vs 32 KB (+87.5% program memory), pin-to-pin compatible 64-LQFP

📋 Reference alternative (not in catalog)

MC9S08DZ96CLH

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10)
HCS08 8-bit · S08DZ · 40 MHz · 20 MHz · 96 KB · 6 KB · 2 KB · 64-LQFP (10x10 mm)

✓ In Stock

$6.21 / Unit

View Datasheet →

MC9S08DZ32AMLH

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10)
HCS08 (S08 core) · 8-Bit · HC08 with added BGND instruction (CISC) · 40 MHz · 20 MHz · 32KB (32K x 8) FLASH · 3.3V / 5V · 12 bit

✓ In Stock

Contact for price

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S9S08DZ32F2CLH

✅ Drop-In
📦 64-LQFP (10x10)
Newer S9 prefix product tier, 32KB Flash, same 64-LQFP footprint

📋 Reference alternative (not in catalog)

MC9S08DV128CLH

✅ Drop-In
NXP Semiconductors
📦 64-LQFP
HCS08 (enhanced S08 core) · 8-bit · 40 MHz · 20 MHz · 128 KB (128K x 8) Flash · 6 KB (6K x 8) · 53 · 64-LQFP (10x10 mm)

✓ In Stock

$4.42 / Unit

View Datasheet →

MC9S08DZ32ACLH Maximum Ratings & Electrical Characteristics

Core HCS08 (enhanced S08)
Data Bus Width 8 bit
Maximum Clock Frequency 40 MHz (CPU); 20 MHz bus
Program Memory Size 32 KB Flash
RAM Size 2 KB
Supply Voltage Range 2.7 V to 5.5 V
Operating Temperature Range -40 C to +85 C
Package 64-LQFP (10x10 mm)
Mounting Type Surface Mount
Connectivity CANbus, I2C, LINbus, SCI, SPI
Peripherals LCD driver, ADC, PWM, TIM, BDM
Number of I/Os 54 (typical, varies by peripheral allocation)
MSL Level 3 (168 Hours)
RoHS Status Compliant
Instruction Set HC08 with BGND extension
On-chip Debug Background Debug Mode (BDM)

MC9S08DZ32ACLH Pin Configuration

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
Pin 1 PTC0 — General-purpose I/O / timer channel
Pin 8 TCLK — Timer external clock input
Pin 16 VDD — Digital supply voltage
Pin 32 VSS — Digital ground
Pin 40 CANTX — MSCAN transmit output
Pin 41 CANRX — MSCAN receive input
Pin 48 RESET — Active-low external reset
Pin 50 BKGD — Background Debug Mode (BDM)
Pin 56 XTAL — Oscillator input
Pin 57 EXTAL — Oscillator input/output

Typical Applications

MC9S08DZ32ACLH is suitable for 7 applications: Automotive CAN Body Control Module, Industrial Sensor Hub with LIN Backhaul, White-Goods User Interface with LCD, Automotive Diagnostic and Telematics Module, Motor Control Peripheral Board (BLDC/Fan/Compressor), Low-Cost Remote-Control Unit (RCU) with RF, Battery Management Sub-Module (BMS).

🚗

Automotive CAN Body Control Module

The MC9S08DZ32ACLH targets automotive body controllers such as door modules, seat controllers, and HVAC nodes where reliable CAN networking and modest code size are required. Its integrated MSCAN peripheral supports CAN 2.0A/B with hardware message filtering, offloading the CPU from per-bit processing. The 40 MHz HCS08 core executes roughly 20 MIPS, sufficient for LIN-to-CAN gateway tasks. The 2 KB RAM accommodates the CAN mailbox stack plus application logic. Typical BOM cost is lowered by combining CAN, SCI/SPI, and the LCD driver on a single chip, avoiding an external display controller. Operating temperature range of -40 C to +85 C covers passenger-compartment environments. Designers should pair the device with an external CAN transceiver such as the TJA1043 or NXP's own TJA1055.

🏭

Industrial Sensor Hub with LIN Backhaul

The MC9S08DZ32ACLH is well-matched to industrial sensor hubs that aggregate analog or digital inputs and forward them through a LIN bus toward a higher-level ECU. The on-chip ADC samples multiple channels while timer/PWM drives actuator outputs. SCI block, with firmware and an external LIN transceiver (e.g., TJA1027), delivers LIN 2.0 slave support. The wide 2.7 V-5.5 V supply accepts 3.3 V and 5 V rails common in industrial panels. Background Debug Mode enables in-circuit firmware updates during panel bring-up. The device's low-power stop modes allow always-on sensor nodes to meet factory energy budgets. Real-world designs segment the 32 KB Flash into bootloader-plus-application regions for field updates over LIN.

📱

White-Goods User Interface with LCD

White-goods appliances such as washing machines, dishwashers, and induction cookers pair the MC9S08DZ32ACLH with a segment-LCD front panel to deliver user feedback plus appliance control. The integrated LCD driver removes the need for an external display controller, reducing BOM cost by 30 to 50 cents per board. The 54 general-purpose I/O pins drive key matrices, LED indicators, and rotary encoders. The 40 MHz core, 2 KB RAM, and on-chip PWM give just-enough headroom for motor-control peripherals such as BLDC or universal motors. The -40 C to +85 C range addresses laundry-room and kitchen-environmental stress. Designers use the on-chip BDM port to factory-flash production firmware.

🚗

Automotive Diagnostic and Telematics Module

Automotive telematics and OBD-II diagnostic devices rely on the MC9S08DZ32ACLH for CAN message capture, UDS-style service handling, and gateway/routing between the diagnostic port and vehicle networks. The on-chip MSCAN and a second CAN-bit-banged channel covers dual-bus OBD-II. Code space of 32 KB and 2 KB RAM are sufficient for ISO 15765 and ISO 14229 transport-layer stacks. The 64-LQFP package exposes enough pins to connect both CAN channels plus a USB-SCI bridge and a status LED. The device operates across 2.7 V-5.5 V and survives cranking transients when paired with a proper automotive voltage regulator. The HCS08 core has the BGND instruction for fast firmware provisioning at the end of the manufacturing line.

⚡

Motor Control Peripheral Board (BLDC/Fan/Compressor)

The MC9S08DZ32ACLH handles small motor-control tasks including BLDC fans, refrigerator compressors, and small pumps where the integrated timer/PWM and ADC simplify the analog front end. The 40 MHz HCS08 core schedules the commutation state machine, current sensing, and protective shutoff within microsecond response windows. The 2 KB RAM buffers current-loop samples while the 32 KB Flash stores motor-parameter tables. CAN or SCI comms let the board report telemetry to a master controller. The 64-LQFP keeps the footprint compact in appliance and HVAC compressor stages. The on-chip PWM module supports complementary outputs with dead-time insertion for half-bridge drivers.

🧩

Low-Cost Remote-Control Unit (RCU) with RF

Cost-sensitive remote-control units, from industrial key fobs to building-control remotes, take advantage of the MC9S08DZ32ACLH's interrupt-driven I/O and low-power stop modes. The device wakes on a button interrupt, performs an action, then returns to sub-mA sleep. The SCI or SPI peripheral pairs with an external RF transceiver for one-way or two-way links. 32 KB Flash accommodates rolling-code encryption or addressing tables; 2 KB RAM holds the transmit buffer. The 64-LQFP allows generous I/O for key matrices and LED indicators. BDM programming simplifies fleet provisioning. Designers keep the clock on the internal reference at low frequencies and switch to FLL only for active transmissions.

⚡

Battery Management Sub-Module (BMS)

The MC9S08DZ32ACLH plays a useful role in battery-management sub-modules where cell monitoring, passive balancing, and fault logging are required but the main controller is reserved for pack-level control. The device's ADC reads individual cell voltages while timer pins drive balance resistors. CAN and SCI allow the sub-module to report cell health to the pack controller and accept configuration updates. The 2.7 V-5.5 V supply is compatible with 3.3 V LDO regulators after a pre-regulator clamps the high-voltage pack. The integrated LCD driver helps drive status displays on service tools. The 32 KB Flash stores cell-lookup tables and balancing algorithms.

What is the maximum clock frequency of the MC9S08DZ32ACLH?
The MC9S08DZ32ACLH core runs at up to 40 MHz, while the peripheral bus operates at 20 MHz. According to the NXP device overview, the HCS08 CPU executes most instructions in one bus cycle, yielding approximately 20 MIPS at the 40 MHz top speed. Designers must balance bus-clocked peripherals (timers, SCI) against the CPU clock when configuring the internal FLL.
Does the MC9S08DZ32ACLH have integrated CAN?
Yes, the MC9S08DZ32ACLH includes an MSCAN (Motorola Scalable CAN) controller that supports CAN 2.0A/B with standard and extended frame formats. The MSCAN module handles message filtering, transmission, and reception with hardware masking. An external CAN transceiver (such as the TJA1050 or TJA1043) is required to connect to the physical bus, since the on-chip peripheral only handles protocol-layer signaling.
What is the difference between MC9S08DZ32ACLH and MC9S08DZ60ACLH?
The MC9S08DZ32ACLH integrates 32 KB of Flash memory, while the MC9S08DZ60ACLH integrates 60 KB of Flash. Both share the same 64-LQFP (10x10 mm) package, the same HCS08 core at 40 MHz, and the same CAN/LIN peripheral set, making them functionally drop-in compatible at the PCB level. Choose DZ60 if your firmware exceeds 32 KB; otherwise the DZ32 is more cost-effective.
Where can I download the MC9S08DZ32ACLH datasheet?
The MC9S08DZ32ACLH datasheet (commonly referenced as 'MC9S08DZ32' in the Freescale/NXP family documentation) can be downloaded directly from the manufacturer's product page. NXP hosts the reference manual, device overview, and application notes alongside the datasheet. Always cross-check the latest revision (look for the change-log page) before committing firmware to a production design.
Can the MC9S08DZ32ACLH be replaced by MC9S08DZ32AMLH?
The MC9S08DZ32AMLH is the same silicon die in the same 64-LQFP package with identical electrical characteristics; the only difference is the temperature grade and product status suffix. The 'A' character in the suffix indicates a specific product longevity/quality tier. Verify suffix-level ordering part numbers in the NXP data brief before swapping, because not every suffix variant is guaranteed drop-in.
Is the MC9S08DZ32ACLH pin-compatible with the S9S08DZ32F2CLH?
Both are 64-pin LQFP devices in the S08DZ family, sharing the same peripheral map and pinout by design. Utmel and other distributors confirm they are pin-compatible. Note the S9 prefix designates a newer product tier, not a different package. The migration path is firmware-compatible provided the register definitions in the header files are regenerated against the corresponding reference manual.
What is the price of the MC9S08DZ32ACLH?
Mouser and DigiKey list the MC9S08DZ32ACLH at roughly 8.94 USD at unit quantity and around 5.32 USD at 1,000-piece volume, as of October 2026. The part is on the NXP NRND (Not Recommended for New Designs) list, which can widen price swings as inventory is consumed. Always request a current quote before placing a production order, since the NRND status may already be pulling stock from distributors.
Is the MC9S08DZ32ACLH still in production?
The NXP product page lists the MC9S08DZ32ACLH as NRND (Not Recommended for New Designs) as of the latest update. This status means the part is still being shipped but NXP does not recommend it for new design-ins. Existing customers can continue ordering, but new designs should evaluate the actively recommended superseding parts in the same S08DZ family or transition to the newer S12 or Kinetis families.
Does the MC9S08DZ32ACLH support LIN communications?
Yes, the S08DZ family integrates an SCI (Serial Communication Interface) block that, with an external LIN transceiver such as the TJA1027, can implement LIN 1.3 or LIN 2.0 slave nodes. The on-chip timer channels can drive LIN baud-rate auto-baud detection. For full LIN master capability you still need a small amount of application-layer software on top of the SCI peripheral.
How much program memory does the MC9S08DZ32ACLH have?
The MC9S08DZ32ACLH integrates 32 KB of embedded Flash for program storage and supports in-application reprogramming through the standard Flash routines in the device header files. The part also reserves a small portion of the Flash array for the bootloader or EEPROM emulation area, depending on your configuration. Refer to the Flash module chapter in the reference manual for security and block-protection settings.
How does the MC9S08DZ32ACLH compare with the MC9S08SH8CTJR?
The Xecor comparison database classifies the MC9S08DZ32ACLH and MC9S08SH8CTJR as functionally equivalent across core parameters (8-bit, S08 family, CAN-capable platform). However, the SH8 ships in a smaller 48-LQFP or 32-QFN package with fewer I/O pins, so the two are NOT pin-for-pin drop-in compatible. Use the DZ32 in your existing 64-LQFP board; use the SH8 only for compact designs.
What is the best cross-brand equivalent for the MC9S08DZ32ACLH?
There is no truly drop-in cross-brand 8-bit MCU with identical peripheral set and pinout on the open market, because CAN + LCD + 32KB Flash + 64-LQFP is a tightly coupled combination. The closest cross-brand option is to migrate the design to a Microchip PIC18 or Atmel ATmega 8-bit MCU in a different package and rewrite CAN stack, which requires PCB rework. For new designs, consider staying within the NXP S08 family or moving to a Kinetis part.
What development tools are available for the MC9S08DZ32ACLH?
NXP supports the S08DZ family with the CodeWarrior IDE (and the new MCUXpresso for legacy S08 via compatibility layer) along with the BDM (Background Debug Mode) interface for in-circuit emulation and flash programming. Third-party toolchains such as IAR Embedded Workbench and Cosmic CX compiler also offer support. Free evaluation boards from Freescale/NXP let you prototype before PCB commitment.
Is the MC9S08DZ32ACLH RoHS compliant?
The MC9S08DZ32ACLH is RoHS compliant per the manufacturer datasheet and the GlobalSpec product card. Lead-free soldering is required for production. The MSL (Moisture Sensitivity Level) is 3 with a 168-hour floor life, so standard surface-mount assembly lines must follow the JEDEC J-STD-033 baking guidelines for sealed packages that have exceeded the floor life.
When should I choose the MC9S08DZ32ACLH over the MC9S08AW32CPUE?
Choose the MC9S08DZ32ACLH for designs that need CAN connectivity and an LCD driver in a 64-LQFP package, since the DZ32 specifically integrates both peripherals on-chip. Choose the MC9S08AW32CPUE instead if your design needs more analog channels or higher I/O count and can live without dedicated CAN or LCD peripherals. Both share the same 40 MHz HCS08 core, but their peripheral mix and package choices differ.

Engineering reference data for MC9S08DZ32ACLH — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S08DZ32ACLH for new designs only if your firmware fits comfortably in 32 KB and you specifically need the CAN + LCD + 40 MHz combination in a 64-LQFP package. The NXP NRND (Not Recommended for New Designs) status is a strong signal to look at same-family drop-in alternatives for new projects. For new designs within the S08DZ family, prefer the actively-produced MC9S08DZ32AMLH or the higher-flash MC9S08DZ60ACLC if your code exceeds 32 KB. Cross-brand alternatives exist but require PCB rework - evaluate carefully. The MC9S08DZ32ACLH remains a reasonable choice for existing designs running smoothly in production.

Comparison with Alternatives

Parameter This Product MC9S08DZ60ACLC MC9S08DZ96CLH MC9S08DZ32AMLH S9S08DZ32F2CLH MC9S08DV128CLH
Package 64-LQFP (10x10 mm) 64-LQFP - same 64-LQFP - same 64-LQFP - same 64-LQFP - same 64-LQFP - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS08 8-bit HCS08 8-bit HCS08 8-bit HCS08 8-bit HCS08 8-bit HCS08 8-bit
Flash Memory 32 KB 60 KB 96 KB 32 KB 32 KB 128 KB
CPU Clock 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
CAN Peripheral Yes (MSCAN) Yes (MSCAN) Yes (MSCAN) Yes (MSCAN) Yes (MSCAN) Yes (MSCAN)
LCD Driver Yes Yes Yes Yes Yes Yes
Lifecycle Status NRND Active Active Active Active Active

Key Differentiators

  • Integrated CAN, LCD driver, and 32 KB Flash in a 64-LQFP single-chip solution (vs Generic 8-bit MCU without CAN)
  • Drop-in 60 KB Flash upgrade on the same 64-LQFP footprint (vs MC9S08DZ60ACLC)
  • On-chip Background Debug Mode (BDM) interface (vs Pre-programmed only MCUs from competitors)

Design Notes

Decouple each VDD pin with a 100 nF ceramic capacitor placed within 5 mm of the IC, and add a 1-10 uF bulk capacitor on the supply rail. The S08DZ family can reset unpredictably during high-current transients if decoupling is inadequate, especially when driving segmented LCD or firing CAN frames. Estimated: based on typical HCS08 decoupling recommendations; consult the device's reference manual for the precise capacitor count.

Place the oscillator crystal or resonator near the XTAL/EXTAL pins and route it over a continuous ground pour to minimize EMI pickup. Avoid routing high-speed signals (CAN, SCI, SPI clock) directly under or near the oscillator trace. Use a guard ring around the oscillator components to shield against radiated coupling from switching regulators on the same board. Reference: Freescale/NXP application note on oscillator PCB layout for S08 family MCUs.

Do not forget to configure the MSCLK and the CAN timing segment registers for the actual oscillator frequency in your board - many bootloading failures on legacy HCS08 designs stem from incorrect CAN baud-rate calculations. The 32 KB Flash is segmented: reserve the last 1-2 KB for the bootloader region if you plan in-application reprogramming. The 2 KB RAM must be split between stack, CAN message buffers, and application data; monitor usage at link time to avoid silent overflow.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS-compliant per NXP product page. Standard 8-bit industrial-grade MCU; not AEC-Q100 qualified. Halogen-free status not explicitly stated in the manufacturer datasheet we reviewed.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor MC9S08DZ32ACLH MC9S08DZ32AMLH MC9S08DZ60ACLC MC9S08DZ96CLH S9S08DZ32F2CLH MC9S08DV128CLH HCS08 core 8-bit microcontroller MSCAN CAN 2.0B LIN bus LCD segment driver Background Debug Mode (BDM) 64-LQFP package 32 KB Flash 2 KB RAM 40 MHz CPU RoHS compliance MSC standard I2C bus SCI peripheral SPI bus automotive body control white goods user interface
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