MC9S08GT60ACFBE vs MC9S08GT16AMFBE Comparison

Detailed side-by-side comparison of MC9S08GT60ACFBE by NXP Semiconductors and MC9S08GT16AMFBE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08GT60ACFBE MC9S08GT60ACFBE - 8-Bit 40MHz 60KB Flash S08 MCU | NXP

MC9S08GT60ACFBE - 8-Bit 40MHz 60KB Flash S08 MCU | NXP

MC9S08GT60ACFBE Nrnd
NXP Semiconductors
MC9S08GT16AMFBE MC9S08GT16AMFBE - 8-bit HCS08 MCU 16KB Flash 40MHz QFP-44 | NXP

MC9S08GT16AMFBE - 8-bit HCS08 MCU 16KB Flash 40MHz QFP-44 | NXP

MC9S08GT16AMFBE ✓ Active

Specification Comparison

Parameter MC9S08GT60ACFBE MC9S08GT16AMFBE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Active
Stock Status In Stock In Stock
Unit Price (USD) $9.85 $4.65
Core Architecture HCS08 (enhanced S08) —
CPU Bit Width 8-bit —
Maximum CPU Frequency 40 MHz (20 MHz bus) —
Program Memory (Flash) 60 KB (60K x 8) —
RAM 4 KB —
I/O Pins 34 —
ADC 8-channel, 10-bit 10-bit
Supply Voltage 1.8 V to 3.6 V —
Communication Interfaces 1x SCI, 1x SPI, 1x I2C —
Timers Multiple TPM channels [DATA_NEEDED: exact channel count] —
Package 44-QFP (10x10 mm) 44-LQFP / 44-QFP (10x10 mm)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40 C to +85 C (industrial) -40 C to +85 C
Instruction Set CISC, HC08 with BGND —
Interrupt Sources Up to 32 —
Pull-ups Software-selectable on ports —
RoHS Status Compliant Compliant
Core — HCS08 (S08)
Core Size — 8-bit
Maximum Clock Speed — 40 MHz
Program Memory Size — 16 KB (16K x 8) Flash
RAM Size — 2 KB (2K x 8)
EEPROM Size — Not present
Supply Voltage Range — 1.8 V to 3.6 V
Number of I/O — 36 (maximum)
Connectivity — I2C, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Instruction Set Compatibility — HC08 with BGND instruction
MSL Level — 3 (168 hours)
Lead-Free — Yes

Datasheets & Resources

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