MC9S08GT60ACFBE vs MC9S08GT16AMFBE Vergleich
Detaillierter Direktvergleich von MC9S08GT60ACFBE von NXP Semiconductors und MC9S08GT16AMFBE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08GT16AMFBE - 8-bit HCS08 MCU 16KB Flash 40MHz QFP-44 | NXP
MC9S08GT16AMFBE ✓ AktivSpezifikationsvergleich
| Parameter | MC9S08GT60ACFBE | MC9S08GT16AMFBE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,85 | $4,65 |
| Core Architecture | HCS08 (enhanced S08) | — |
| CPU Bit Width | 8-bit | — |
| Maximum CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM | 4 KB | — |
| I/O Pins | 34 | — |
| ADC | 8-channel, 10-bit | 10-bit |
| Versorgungsspannung | 1.8 V to 3.6 V | — |
| Communication Interfaces | 1x SCI, 1x SPI, 1x I2C | — |
| Timers | Multiple TPM channels [DATA_NEEDED: exact channel count] | — |
| Gehäuse | 44-QFP (10x10 mm) | 44-LQFP / 44-QFP (10x10 mm) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40 C to +85 C (industrial) | -40 C to +85 C |
| Instruction Set | CISC, HC08 with BGND | — |
| Interrupt Sources | Up to 32 | — |
| Pull-ups | Software-selectable on ports | — |
| RoHS-Status | Compliant | Compliant |
| Core | — | HCS08 (S08) |
| Core Size | — | 8-bit |
| Maximum Clock Speed | — | 40 MHz |
| Program Memory Size | — | 16 KB (16K x 8) Flash |
| RAM Size | — | 2 KB (2K x 8) |
| EEPROM Size | — | Not present |
| Supply Voltage Range | — | 1.8 V to 3.6 V |
| Number of I/O | — | 36 (maximum) |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Instruction Set Compatibility | — | HC08 with BGND instruction |
| MSL-Level | — | 3 (168 hours) |
| Lead-Free | — | Yes |