MC9S08PA16VTJ vs MC9S08QD4CSC Comparison
Detailed side-by-side comparison of MC9S08PA16VTJ by NXP Semiconductors and MC9S08QD4CSC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08PA16VTJ | MC9S08QD4CSC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1.18 | $0.00 |
| Core Architecture | HCS08L (S08 family) | — |
| Data Bus Width | 8 bit | — |
| Program Memory (Flash) | 16 KB | — |
| RAM | [DATA_NEEDED: RAM size in KB] | 256 B |
| EEPROM (emulated) | Yes (in flash, configurable) | — |
| Maximum Bus Frequency | 20 MHz | — |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| Operating Temperature | -40 C to +105 C | [DATA_NEEDED: operating temperature range] |
| Package | 20-pin TSSOP | 8-SOIC |
| Mounting Type | Surface Mount (TSSOP) | Surface Mount |
| I/O Pins | Up to 18 GPIO | — |
| ADC | On-chip SAR ADC (channel count [DATA_NEEDED: ADC channels]) | — |
| Analog Comparator | Yes | — |
| Timers | FlexTimer (PWM-capable, channel count [DATA_NEEDED: PWM channels]) | — |
| Interrupts | Up to 40 sources, 4-level nested | — |
| Low-Power Modes | Wait, Stop (low-power) | — |
| Debug Interface | BDM (Background Debug Mode) | Background debugging system (single-wire BDM) |
| Watchdog | COP watchdog | — |
| RoHS Status | Compliant | — |
| Lead-Free / MSL | Lead-free; MSL [DATA_NEEDED: MSL level] | — |
| Tube Packaging Standard Qty | Per tube (qty [DATA_NEEDED: tube qty]) | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Maximum Clock Frequency | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| Supply Voltage | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |