MC9S08PA16VTJ vs MC9S08QD4CSC Vergleich
Detaillierter Direktvergleich von MC9S08PA16VTJ von NXP Semiconductors und MC9S08QD4CSC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08PA16VTJ | MC9S08QD4CSC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,18 | $0,00 |
| Core Architecture | HCS08L (S08 family) | — |
| Datenbusbreite | 8 bit | — |
| Program Memory (Flash) | 16 KB | — |
| RAM | [DATA_NEEDED: RAM size in KB] | 256 B |
| EEPROM (emulated) | Yes (in flash, configurable) | — |
| Maximum Bus Frequency | 20 MHz | — |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| Betriebstemperatur | -40 C to +105 C | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 20-pin TSSOP | 8-SOIC |
| Montageart | Surface Mount (TSSOP) | Surface Mount |
| I/O Pins | Up to 18 GPIO | — |
| ADC | On-chip SAR ADC (channel count [DATA_NEEDED: ADC channels]) | — |
| Analog Comparator | Yes | — |
| Timers | FlexTimer (PWM-capable, channel count [DATA_NEEDED: PWM channels]) | — |
| Interrupts | Up to 40 sources, 4-level nested | — |
| Low-Power Modes | Wait, Stop (low-power) | — |
| Debug Interface | BDM (Background Debug Mode) | Background debugging system (single-wire BDM) |
| Watchdog | COP watchdog | — |
| RoHS-Status | Compliant | — |
| Lead-Free / MSL | Lead-free; MSL [DATA_NEEDED: MSL level] | — |
| Tube Packaging Standard Qty | Per tube (qty [DATA_NEEDED: tube qty]) | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Maximale Taktfrequenz | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| Versorgungsspannung | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |