MC9S08QD2VSC vs MC9S08SH4MFK Comparison

Detailed side-by-side comparison of MC9S08QD2VSC by NXP Semiconductors and MC9S08SH4MFK by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08QD2VSC MC9S08QD2VSC - 8-bit S08 MCU, 2KB Flash, 16MHz, SOIC-8 | NXP

MC9S08QD2VSC - 8-bit S08 MCU, 2KB Flash, 16MHz, SOIC-8 | NXP

MC9S08QD2VSC ✓ Active
NXP Semiconductors
MC9S08SH4MFK MC9S08SH4MFK - 8-bit HCS08 MCU 4KB Flash 40MHz QFN-24 | NXP

MC9S08SH4MFK - 8-bit HCS08 MCU 4KB Flash 40MHz QFN-24 | NXP

MC9S08SH4MFK ✓ Active

Specification Comparison

Parameter MC9S08QD2VSC MC9S08SH4MFK
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.81 $2.15
Core Architecture HCS08 (enhanced HC08) —
Program Memory (Flash) 2 KB (2K x 8) —
RAM 256 bytes —
CPU Clock (max) 16 MHz —
Operating Voltage 2.7 V to 5.5 V —
ADC 4-channel, 10-bit 12-channel, 10-bit, 2.5 us conversion
GPIO Pins 6 —
Timers [DATA_NEEDED: timer module count] —
Communication Peripherals [DATA_NEEDED: SCI/SPI/I2C configuration] —
Package 8-SOIC (SO-8) —
Mounting Type Surface Mount Surface Mount
MSL Level 3 (168 hours) —
Operating Temperature -40 C to +85 C (V suffix = industrial) -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade])
RoHS Status Compliant —
Debug Interface Background Debug Mode (BDM) —
Internal Oscillator Yes (factory trimmed) —
Core — HCS08 (8-bit)
Program Memory Size — 4 KB (4K x 8) Flash
RAM Size — 256 B
Maximum CPU Clock — 40 MHz
Number of I/O Pins — 17
Package / Case — 24-VFQFN Exposed Pad (4x4 mm)
Supply Voltage Range — 2.7 V to 5.5 V
Oscillator Type — Internal
Interrupt/Reset Sources — Up to 32
Instruction Set — HC08 with BGND instruction
Packaging — Tray
Compliance — RoHS compliant ([DATA_NEEDED: confirm exact status])

Datasheets & Resources

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