MC9S08QD2VSC vs MC9S08SH4MFK Vergleich

Detaillierter Direktvergleich von MC9S08QD2VSC von NXP Semiconductors und MC9S08SH4MFK von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08QD2VSC MC9S08QD2VSC - 8-bit S08 MCU, 2KB Flash, 16MHz, SOIC-8 | NXP

MC9S08QD2VSC - 8-bit S08 MCU, 2KB Flash, 16MHz, SOIC-8 | NXP

MC9S08QD2VSC ✓ Aktiv
NXP Semiconductors
MC9S08SH4MFK MC9S08SH4MFK - 8-bit HCS08 MCU 4KB Flash 40MHz QFN-24 | NXP

MC9S08SH4MFK - 8-bit HCS08 MCU 4KB Flash 40MHz QFN-24 | NXP

MC9S08SH4MFK ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S08QD2VSC MC9S08SH4MFK
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,81 $2,15
Core Architecture HCS08 (enhanced HC08) —
Program Memory (Flash) 2 KB (2K x 8) —
RAM 256 bytes —
CPU Clock (max) 16 MHz —
Operating Voltage 2.7 V to 5.5 V —
ADC 4-channel, 10-bit 12-channel, 10-bit, 2.5 us conversion
GPIO Pins 6 —
Timers [DATA_NEEDED: timer module count] —
Communication Peripherals [DATA_NEEDED: SCI/SPI/I2C configuration] —
Gehäuse 8-SOIC (SO-8) —
Montageart Surface Mount Surface Mount
MSL-Level 3 (168 hours) —
Betriebstemperatur -40 C to +85 C (V suffix = industrial) -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade])
RoHS-Status Compliant —
Debug Interface Background Debug Mode (BDM) —
Internal Oscillator Yes (factory trimmed) —
Core — HCS08 (8-bit)
Program Memory Size — 4 KB (4K x 8) Flash
RAM Size — 256 B
Maximum CPU Clock — 40 MHz
Number of I/O Pins — 17
Gehäuse / Bauform — 24-VFQFN Exposed Pad (4x4 mm)
Supply Voltage Range — 2.7 V to 5.5 V
Oscillator Type — Internal
Interrupt/Reset Sources — Up to 32
Instruction Set — HC08 with BGND instruction
Packaging — Tray
Compliance — RoHS compliant ([DATA_NEEDED: confirm exact status])

Datenblätter & Ressourcen

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