MC9S08QE4CPG vs MC9S08QG4CFFE Comparison
Detailed side-by-side comparison of MC9S08QE4CPG by NXP Semiconductors and MC9S08QG4CFFE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08QE4CPG | MC9S08QG4CFFE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.05 | $1.10 |
| Core | S08 (HCS08) 8-bit CPU | — |
| CPU Maximum Frequency | 20 MHz (50.33 MHz bus at VDD >= 2.1 V) | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 512 B | — |
| Supply Voltage (VDD) | 1.8 V to 3.6 V | — |
| Operating Temperature Range | -40C to +85C (industrial) | [DATA_NEEDED: operating temperature range] |
| Package | 16-pin PDIP (DIP-16, through-hole) | 16-QFN-EP (5x5 mm), QFN EP |
| I/O Pins | Up to 12 general-purpose I/O (per 16-pin package) | — |
| ADC | Integrated multi-channel ADC [DATA_NEEDED: channel count and resolution] | — |
| Timers | Multiple TPM/MTIM channels plus periodic interrupt timer [DATA_NEEDED: exact channel count] | — |
| Communication | SCI/UART, SPI, I2C [DATA_NEEDED: instance count per peripheral] | — |
| Low-Power Stop Mode Current | Approx. 1 uA | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Mounting Type | Through-Hole (PDIP) | Surface Mount |
| RoHS Status | Compliant | — |
| Family | S08QE (Flexis, 8/32-bit pin-compatible family) | — |
| Lifecycle Stage | ACTIVE | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Maximum Clock Frequency | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Supply Voltage | — | 2.5 V / 3.3 V |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Lifecycle Status | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |