MC9S08QE4CPG vs MC9S08QG4CFFE Vergleich

Detaillierter Direktvergleich von MC9S08QE4CPG von NXP Semiconductors und MC9S08QG4CFFE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08QE4CPG MC9S08QE4CPG - 8-Bit 20MHz 4KB Flash MCU | NXP DIP-16

MC9S08QE4CPG - 8-Bit 20MHz 4KB Flash MCU | NXP DIP-16

MC9S08QE4CPG ✓ Aktiv
NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ Abgekündigt

Spezifikationsvergleich

Parameter MC9S08QE4CPG MC9S08QG4CFFE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Ende des Lebenszyklus
Lagerstatus In Stock In Stock
Stückpreis (USD) $2,05 $1,10
Core S08 (HCS08) 8-bit CPU —
CPU Maximum Frequency 20 MHz (50.33 MHz bus at VDD >= 2.1 V) —
Program Memory (Flash) 4 KB (4K x 8) —
RAM 512 B —
Supply Voltage (VDD) 1.8 V to 3.6 V —
Betriebstemperaturbereich -40C to +85C (industrial) [DATA_NEEDED: operating temperature range]
Gehäuse 16-pin PDIP (DIP-16, through-hole) 16-QFN-EP (5x5 mm), QFN EP
I/O Pins Up to 12 general-purpose I/O (per 16-pin package) —
ADC Integrated multi-channel ADC [DATA_NEEDED: channel count and resolution] —
Timers Multiple TPM/MTIM channels plus periodic interrupt timer [DATA_NEEDED: exact channel count] —
Communication SCI/UART, SPI, I2C [DATA_NEEDED: instance count per peripheral] —
Low-Power Stop Mode Current Approx. 1 uA —
Debug Interface Background Debug Mode (BDM) —
Montageart Through-Hole (PDIP) Surface Mount
RoHS-Status Compliant —
Family S08QE (Flexis, 8/32-bit pin-compatible family) —
Lifecycle Stage ACTIVE —
Core Processor — S08
Core Size — 8-Bit
CPU Architecture — HCS08 CISC, HC08 instruction set with added BGND instruction
Maximale Taktfrequenz — 20 MHz
Program Memory Size — 4KB (4K x 8) FLASH
Versorgungsspannung — 2.5 V / 3.3 V
Package Code — HVQCCN
Package Shape — Square
Number of Terminals — 16
Terminal Form — No Lead
Temperature Grade — Industrial
Series — S08QG (QG Series, S08 Family)
Debug Features — Background debugging system, single breakpoint in-circuit plus two more on-chip
Packaging — Tray
Lebenszyklusstatus — End of Life (per NXP product page)
Program RAM Size — [DATA_NEEDED: Program RAM size]
ADC Resolution — [DATA_NEEDED: ADC resolution and channels]
Number of I/O — [DATA_NEEDED: number of GPIO]
Data Converters — [DATA_NEEDED: on-chip data converter summary]

Datenblätter & Ressourcen

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