MC9S08QG4CDTE vs MC9S08QG4CFFE Comparison

Detailed side-by-side comparison of MC9S08QG4CDTE by NXP Semiconductors and MC9S08QG4CFFE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08QG4CDTE MC9S08QG4CDTE - 20MHz 8-Bit 4KB MCU | NXP

MC9S08QG4CDTE - 20MHz 8-Bit 4KB MCU | NXP

MC9S08QG4CDTE ✓ Active
NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ End of Life

Specification Comparison

Parameter MC9S08QG4CDTE MC9S08QG4CFFE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active End of Life
Stock Status In Stock In Stock
Unit Price (USD) $2.76 $1.10
Product Type 8-bit S08 CISC microcontroller —
CPU Clock 20 MHz —
Program Memory 4 KB flash —
Program Memory Organization 4K x 8 bits —
Supply Voltage Range 1.8 V to 3.6 V —
Architecture HCS08 enhanced 8-bit core —
Instruction Set HC08 instruction set with BGND instruction —
I/O Port Count 6 —
Package 16-TSSOP 16-QFN-EP (5x5 mm), QFN EP
Mounting Type Surface mount Surface Mount
Debug Support Background debugging system with single breakpoint capability —
Product Family S08QG —
Core Category 8-bit microcontroller —
Application Category Low-power embedded control —
Operating Temperature [DATA_NEEDED: operating temperature range] —
RAM Size [DATA_NEEDED: RAM size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
RoHS Status [DATA_NEEDED: RoHS compliance status] —
Core Processor — S08
Core Size — 8-Bit
CPU Architecture — HCS08 CISC, HC08 instruction set with added BGND instruction
Maximum Clock Frequency — 20 MHz
Program Memory Size — 4KB (4K x 8) FLASH
Supply Voltage — 2.5 V / 3.3 V
Package Code — HVQCCN
Package Shape — Square
Number of Terminals — 16
Terminal Form — No Lead
Temperature Grade — Industrial
Series — S08QG (QG Series, S08 Family)
Debug Features — Background debugging system, single breakpoint in-circuit plus two more on-chip
Packaging — Tray
Lifecycle Status — End of Life (per NXP product page)
Program RAM Size — [DATA_NEEDED: Program RAM size]
ADC Resolution — [DATA_NEEDED: ADC resolution and channels]
Number of I/O — [DATA_NEEDED: number of GPIO]
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
Data Converters — [DATA_NEEDED: on-chip data converter summary]

Datasheets & Resources

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