MC9S08QG4CDTE vs MC9S08QG4CFFE Vergleich
Detaillierter Direktvergleich von MC9S08QG4CDTE von NXP Semiconductors und MC9S08QG4CFFE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08QG4CDTE | MC9S08QG4CFFE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,76 | $1,10 |
| Product Type | 8-bit S08 CISC microcontroller | — |
| CPU Clock | 20 MHz | — |
| Program Memory | 4 KB flash | — |
| Program Memory Organization | 4K x 8 bits | — |
| Supply Voltage Range | 1.8 V to 3.6 V | — |
| Architecture | HCS08 enhanced 8-bit core | — |
| Instruction Set | HC08 instruction set with BGND instruction | — |
| I/O Port Count | 6 | — |
| Gehäuse | 16-TSSOP | 16-QFN-EP (5x5 mm), QFN EP |
| Montageart | Surface mount | Surface Mount |
| Debug Support | Background debugging system with single breakpoint capability | — |
| Product Family | S08QG | — |
| Core Category | 8-bit microcontroller | — |
| Application Category | Low-power embedded control | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Maximale Taktfrequenz | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Versorgungsspannung | — | 2.5 V / 3.3 V |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Lebenszyklusstatus | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |