MC9S08QG8CFQE vs MC9S08QG4CFFE Comparison
Detailed side-by-side comparison of MC9S08QG8CFQE by NXP Semiconductors and MC9S08QG4CFFE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S08QG8CFQE - 8-Bit HCS08 MCU 8KB Flash 20MHz | NXP
MC9S08QG8CFQE ⚠ Last Time Buy
Specification Comparison
| Parameter | MC9S08QG8CFQE | MC9S08QG4CFFE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $1.10 |
| Core | HCS08 (enhanced S08) | — |
| CPU Architecture | 8-bit CISC | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Maximum CPU Frequency | 20 MHz | — |
| Program Memory (Flash) | 8 KB (8K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| Supply Voltage (VDD) | 1.8 V to 3.6 V | — |
| I/O Pins | Up to 6 | — |
| Package | 8-pin DFN-EP (4x4 mm) | 16-QFN-EP (5x5 mm), QFN EP |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| On-chip Debug | Background Debug Mode (BDCS), 1 + 2 breakpoints | — |
| Instruction Set | HC08 + BGND | — |
| ROM Type | Flash | — |
| RoHS Status | ROHS compliant (per datasheet) | — |
| Lifecycle Status | End-of-Life / Last Time Buy (per NXP product page) | End of Life (per NXP product page) |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| Maximum Clock Frequency | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Supply Voltage | — | 2.5 V / 3.3 V |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |