MC9S08QG8CFQE vs MC9S08QG4CFFE 比較
詳細な並列比較: MC9S08QG8CFQE メーカー: NXP Semiconductors および MC9S08QG4CFFE メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | MC9S08QG8CFQE | MC9S08QG4CFFE |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | ラストバイ | 製造終了 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $0.00 | $1.10 |
| Core | HCS08 (enhanced S08) | — |
| CPU Architecture | 8-bit CISC | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Maximum CPU Frequency | 20 MHz | — |
| Program Memory (Flash) | 8 KB (8K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| Supply Voltage (VDD) | 1.8 V to 3.6 V | — |
| I/O Pins | Up to 6 | — |
| パッケージ | 8-pin DFN-EP (4x4 mm) | 16-QFN-EP (5x5 mm), QFN EP |
| 実装タイプ | Surface Mount | Surface Mount |
| 動作温度範囲 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| On-chip Debug | Background Debug Mode (BDCS), 1 + 2 breakpoints | — |
| Instruction Set | HC08 + BGND | — |
| ROM Type | Flash | — |
| RoHS ステータス | ROHS compliant (per datasheet) | — |
| ライフサイクル状態 | End-of-Life / Last Time Buy (per NXP product page) | End of Life (per NXP product page) |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| 最大クロック周波数 | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| 電源電圧 | — | 2.5 V / 3.3 V |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |