MC9S08SH8CFK vs MC9S08QG4CFKE Comparison

Detailed side-by-side comparison of MC9S08SH8CFK by NXP Semiconductors and MC9S08QG4CFKE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08SH8CFK MC9S08SH8CFK - 8-Bit 40MHz S08SH MCU, 8KB Flash, 24-QFN | NXP

MC9S08SH8CFK - 8-Bit 40MHz S08SH MCU, 8KB Flash, 24-QFN | NXP

MC9S08SH8CFK ✗ End of Life
NXP Semiconductors
MC9S08QG4CFKE MC9S08QG4CFKE - 8-bit MCU, 4KB Flash, 20MHz, 24-QFN | NXP

MC9S08QG4CFKE - 8-bit MCU, 4KB Flash, 20MHz, 24-QFN | NXP

MC9S08QG4CFKE ✓ Active

Specification Comparison

Parameter MC9S08SH8CFK MC9S08QG4CFKE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status End of Life Active
Product Type 8-bit Microcontroller (MCU) —
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Family S08SH (HCS08 low-cost 5 V family) —
CPU Core Enhanced HCS08 core, HC08 instruction set with BGND instruction —
Maximum CPU Frequency 40 MHz —
Program Memory (Flash) 8 KB (8K x 8) —
ADC 12-channel, 10-bit resolution, 2.5 us conversion time 10-bit (per LCSC listing)
ADC Features Automatic compare function, integrated temperature sensor —
Serial Interfaces SCI, SPI, I2C —
Interrupt Sources Up to 32 interrupt/reset sources —
Supply Class 5-volt range low-end S08SH positioning —
Process Technology 0.25 um —
Package Type QFN-24 with exposed pad (QFNL), 4 x 4 mm, 1 mm height —
Package Outline MO-220VGGD-6 —
Pin Count 24 pins —
Mounting Type Surface Mount Surface Mount
Tool and Software Compatibility Pin, tool and software compatible with S08SG family —
RoHS Status [DATA_NEEDED: RoHS compliance status] Compliant
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Core Architecture — HCS08 (S08)
Core Size — 8-bit
Maximum CPU Clock — 20 MHz
Program Memory — 4 KB Flash (4K x 8)
RAM — [DATA_NEEDED: RAM size in bytes]
Supply Voltage Range — 1.8 V to 3.6 V
Operating Temperature — -40 C to +85 C
I/O Ports — 6 (per distributor listing)
Package — 24-QFN-EP (4x4 mm)
Debug Interface — Background Debug Mode (BDM), single breakpoint
Instruction Set — HC08 with BGND instruction
MSL Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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