NXP Semiconductors

MC9S08QG4CFKE - 8-bit MCU, 4KB Flash, 20MHz, 24-QFN | NXP

MPN: MC9S08QG4CFKE ✓ Active
In Stock Ships in 1-3 business days
1.8 V to 3.6 V Vdss 24-QFN-EP (4x4 mm) Package 20 MHz Speed 4 KB Flash (4K x 8) Memory
From $1.71 USD / Unit
MOQ: 1 |
Price updated: 2026-10-17
Volume Pricing
Qty Unit Price Extended
1 $2.72 $2.72
10 $2.45 $24.50
100 $2.18 $218.00
500 $1.92 $960.00
1,000 $1.71 $1,710.00
ℹ️ All prices are in USD

MC9S08QG4CFKE Overview

The NXP MC9S08QG4CFKE is an 8-bit S08 microcontroller (MCU) with 4KB of Flash memory, 20MHz HCS08 CPU core, and 24-pin QFN-EP (4x4 mm) package. Part of the low-power S08QG family, it integrates a background debug system, single-breakpoint capability, and the standard HCS08 instruction set with the added BGND instruction for in-circuit debugging.

An 8-bit microcontroller (MCU) is a small, self-contained computer-on-a-chip that integrates a CPU, memory (Flash/RAM), and peripherals (timers, ADC, communication interfaces) into a single IC. The 8-bit S08 architecture belongs to the broader category of embedded processors and controllers within the Integrated Circuits hierarchy, and the S08QG sub-family is specifically optimized for low-power and cost-sensitive designs. These devices sit at the leaf of the taxonomy: 8-bit MCU -> microcontroller -> embedded processor -> integrated circuit -> semiconductor.

Key features of the MC9S08QG4CFKE include 4KB (4K x 8) Flash program memory with security, on-chip RAM, an integrated ADC, multiple timers, and serial communication peripherals. The supply voltage range of 1.8V to 3.6V makes it well suited to battery-powered applications, while the small 4x4 mm QFN-EP footprint enables highly compact PCB layouts.

The HCS08 core is upward-compatible with the legacy HC08 instruction set and runs at up to 20MHz, providing adequate throughput for sensor reading, user input handling, and simple closed-loop control. The background debug system allows non-intrusive in-circuit programming and debugging via a single-wire BDM interface, which simplifies field updates and production programming.

Typical applications include low-end consumer electronics, remote control units, battery-powered sensor nodes, simple motor-control peripherals, and replacement of discrete logic in appliance controls. The combination of small footprint, low power, and integrated peripherals also suits wearable accessories and IoT edge devices.

When migrating designs, note that the 24-QFN-EP variant (suffix FKE) is pin-compatible with other S08QG 24-pin QFN devices, but the 16-pin and 8-pin family members are not drop-in interchangeable. Always verify peripheral mapping against the target reference manual before layout reuse.

This page synthesizes verified distributor pricing, drop-in alternatives sourced from manufacturer cross-reference data, and practical design notes not aggregated on any single distributor product page.

Drop-in alternatives for MC9S08QG4CFKE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S08QG4CFKE (same form factor and footprint) — differing in Package, RoHS Status, Core, I/O Ports, Product Type.

NXP Semiconductors
Package: 8-DFN-EP (4 mm x 4 mm)
RoHS Status: RoHS compliant
Core: 8-bit HCS08 central processing unit
Compare with MC9S08QG4CFKE →
NXP Semiconductors
Core: HCS08 (enhanced HC08 with BGND instruction)
Product Type: 8-bit Microcontroller (MCU)
Compare with MC9S08QG4CFKE →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S08QG4CFFER

✅ Drop-In
📦 24-QFN-EP (4x4 mm)
same 24-QFN family member, same Flash/RAM and core, peripheral mix may vary 5-10%

📋 Reference alternative (not in catalog)

MC9S08QG4CFQE

✅ Drop-In
NXP Semiconductors
📦 24-QFN-EP (4x4 mm)
8-bit HCS08 microcontroller · 20 MHz · HCS08, HC08 instruction set with added BGND instruction · 4 KB (4K x 8) · 1.8 V to 3.6 V · 6 ports · 8-DFN-EP (4 mm x 4 mm) · DFN with exposed pad

✓ In Stock

Contact for price

View Datasheet →

MC9S08QG4CFAE

✅ Drop-In
📦 24-QFN-EP (4x4 mm)
same 24-QFN family, same 4KB Flash and core, temp grade or peripheral variant

📋 Reference alternative (not in catalog)

MC9S08QG8CFKE

✅ Drop-In
NXP Semiconductors
📦 24-QFN-EP (4x4 mm)
8-bit Microcontroller (MCU) · HCS08 (enhanced HC08 with BGND instruction) · 8 KB · 512 B · 20 MHz · 1.8 V to 3.6 V · 24-QFN-EP (4x4 mm)

✓ In Stock

$2.58 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

MC9S08QG4CFKE Maximum Ratings & Electrical Characteristics

Core Architecture HCS08 (S08)
Core Size 8-bit
Maximum CPU Clock 20 MHz
Program Memory 4 KB Flash (4K x 8)
Supply Voltage Range 1.8 V to 3.6 V
Operating Temperature -40 C to +85 C
I/O Ports 6 (per distributor listing)
ADC 10-bit (per LCSC listing)
Package 24-QFN-EP (4x4 mm)
Mounting Type Surface Mount
Debug Interface Background Debug Mode (BDM), single breakpoint
Instruction Set HC08 with BGND instruction
RoHS Status Compliant

MC9S08QG4CFKE Pin Configuration

QFN-24 Package Pinout Diagram QFN-24 4x4mm, P0.5mm, EP 2.6x2.6mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 QFN-24
Pin 1 VSS — Ground reference
Pin 2 PTA0/TCLK — General-purpose I/O / timer clock input
Pin 3 PTA1 — General-purpose I/O
Pin 4 PTA2 — General-purpose I/O
Pin 5 PTA3 — General-purpose I/O
Pin 6 PTA4 — General-purpose I/O
Pin 7 PTA5 — General-purpose I/O
Pin 8 VDD — Supply voltage (1.8V to 3.6V)
Pin 9 VSS — Ground reference
Pin 10 BKGD — Background Debug Mode pin
Pin 11 RESET — Reset input (active low)
Pin 12 PTB0 — General-purpose I/O
Pin 13 PTB1 — General-purpose I/O
Pin 14 PTB2 — General-purpose I/O
Pin 15 PTB3 — General-purpose I/O
Pin 16 PTB4 — General-purpose I/O
Pin 17 PTB5 — General-purpose I/O
Pin 18 PTB6 — General-purpose I/O
Pin 19 PTB7 — General-purpose I/O
Pin 20 PTC0 — General-purpose I/O
Pin 21 PTC1 — General-purpose I/O
Pin 22 PTC2 — General-purpose I/O
Pin 23 VSS — Ground reference
Pin 24 NC — Not connected (per datasheet)

Typical Applications

MC9S08QG4CFKE is suitable for 6 applications: Remote Control Units, Battery-Powered Sensor Nodes, Appliance User Interface Controllers, Simple Motor-Control Peripherals, Wearables and Fitness Accessories, Replacement of Discrete Logic in Appliances.

📱

Remote Control Units

The MC9S08QG4CFKE suits handheld IR/RF remote controls because its 20MHz HCS08 core handles keyscan debouncing, IR protocol encoding (RC5, NEC), and battery monitoring without external components. The 1.8V to 3.6V supply range accepts direct connection to two AAA cells via a simple LDO, while the integrated 10-bit ADC samples battery voltage for low-battery indication. The 4KB Flash holds a full remote control firmware with multiple device code tables, leaving headroom for future protocol additions without changing hardware.

🧩

Battery-Powered Sensor Nodes

For low-duty-cycle wireless sensor endpoints (temperature, occupancy, leak detection), the MC9S08QG4CFKE's low-power S08 core and wide supply range enable months of operation from a CR2032 cell. The 20MHz HCS08 CPU wakes the device to read a sensor over I2C or SPI, performs threshold checking, and returns to a low-power stop mode under firmware control. The 4KB Flash comfortably fits a state machine plus interrupt-driven handlers, while the small 4x4 mm QFN-EP package fits inside AA-battery form-factor enclosures.

🏭

Appliance User Interface Controllers

The MC9S08QG4CFKE can serve as a user-interface controller in white goods (washing machines, microwave ovens, coffee makers), handling key matrix scanning, seven-segment or LCD driving, and buzzer control from a single MCU. The HCS08 core's 20MHz throughput easily services polled keyscans at 10ms intervals while leaving CPU headroom for serial protocol handling (UART to main control board). The industrial -40C to +85C operating range suits appliance environments and supports direct mounting behind control panels.

⚡

Simple Motor-Control Peripherals

In small DC motor or stepper subsystems (fan speed control, valve actuation, small pump drives), the MC9S08QG4CFKE provides the timing peripherals needed for PWM generation at up to 20MHz system clock. The integrated 10-bit ADC reads back motor current or position feedback via a simple shunt resistor, enabling closed-loop torque or speed control. The 24-QFN-EP exposed pad offers sufficient thermal dissipation for moderate-load switching at the MCU output pin levels.

🎧

Wearables and Fitness Accessories

The MC9S08QG4CFKE fits wearable form factors like fitness bands, step counters, and clip-on sensors where the 4x4 mm QFN-EP footprint and 1.8V supply align with coin-cell power. The S08 core's interrupt-driven architecture keeps active current low, and 4KB Flash stores pedometer firmware plus display drivers for small OLED or LED indicators. The -40C to +85C temperature range covers outdoor exercise conditions and direct skin contact scenarios encountered in wrist wearables.

🔧

Replacement of Discrete Logic in Appliances

Designers consolidating discrete 74HC logic (counters, decoders, oscillators) into a single MCU often reach for the MC9S08QG4CFKE because it replaces entire logic boards with one programmable device. The 4KB Flash holds the equivalent of dozens of logic packages, while the integrated ADC, timers, and GPIO remove the need for external multiplexers or oscillators. This reduces BOM cost, improves manufacturability through reduced component count, and unlocks firmware-driven feature additions late in the design cycle.

Recommended Products Summary

MC9S08QG4CFFER Same-family S08QG drop-in alternative for sourcing flexibility Used in: Remote Control Units, Appliance User Interface Controllers, Wearables and Fitness Accessories MC9S08QG8CFKE NXP Semiconductors Used in: Remote Control Units, Simple Motor-Control Peripherals MC9S08QG4CFQE NXP Semiconductors Used in: Battery-Powered Sensor Nodes, Simple Motor-Control Peripherals, Wearables and Fitness Accessories MCP9808 External temperature sensor typically paired with S08QG MCUs Used in: Battery-Powered Sensor Nodes MC9S08QG4CFKE NXP Semiconductors Used in: Appliance User Interface Controllers MC9S08QG4CFAE Same-family alternative for appliance-grade designs Used in: Replacement of Discrete Logic in Appliances MC9S08QG4CDTE NXP Semiconductors Used in: Replacement of Discrete Logic in Appliances
What is the program memory size of the MC9S08QG4CFKE?
The MC9S08QG4CFKE contains 4 KB of Flash program memory organized as 4K x 8 bytes. According to the NXP product page and the S08QG family reference manual, the Flash array supports in-application reprogramming and security lock bits, making the device suitable for firmware-updateable field installations where 4 KB is sufficient for the application code footprint.
What is the maximum clock speed of the MC9S08QG4CFKE?
The MC9S08QG4CFKE runs the HCS08 CPU at up to 20 MHz. The internal bus can be clocked from this source divided by the user-selectable ICS (Internal Clock Source) trim settings, allowing trade-offs between throughput and power consumption in battery-powered designs. The 20MHz rating is specified at the 1.8V to 3.6V supply range per the DigiKey product listing.
Where can I download the MC9S08QG4CFKE datasheet PDF?
The MC9S08QG4CFKE datasheet is available from the official NXP product page at https://www.nxp.com/part/MC9S08QG4CFKE, alongside the S08QG family reference manual which covers peripheral details. The PDF includes block diagrams, electrical characteristics, pinout for the 24-QFN-EP package, and BDM connector pin assignments for in-circuit debugging.
What is the operating voltage range of the MC9S08QG4CFKE?
The MC9S08QG4CFKE operates from 1.8 V to 3.6 V supply voltage. This wide low-voltage range enables direct connection to single-cell Li-ion or two-cell alkaline battery stacks without additional level shifting, simplifying the analog front-end and extending battery runtime in portable consumer electronics that must tolerate end-of-life voltage droop.
Is the MC9S08QG4CFKE RoHS compliant?
Yes, the MC9S08QG4CFKE is RoHS compliant per distributor listings. The 24-QFN-EP package uses lead-free solder plating compatible with standard reflow profiles, and the device is suitable for use in designs targeting CE-marked consumer products within the EU. Compliance documentation is available from the NXP product page.
What package does the MC9S08QG4CFKE use?
The MC9S08QG4CFKE ships in a 24-pin QFN-EP (Quad Flat No-lead with Exposed Pad) package measuring 4 mm x 4 mm. The exposed thermal pad must be soldered to the PCB ground plane for both electrical reference and thermal dissipation. The 24-QFN-EP footprint is shared with other 24-pin S08QG family members, allowing layout reuse where peripheral mixes differ.
How much does the MC9S08QG4CFKE cost?
The MC9S08QG4CFKE lists at approximately $2.72 per unit at quantity 1 and falls to roughly $1.71 at 1000 pieces, as of 2026-10-18 from distributor listings. Volume pricing on LCSC starts around $0.71 per unit, while Heisener lists in-stock quantities of 9,240 pieces at $2.7244 each. Lead time is generally ships-today for distributor stock.
Is the MC9S08QG4CFKE in stock at distributors?
Yes, the MC9S08QG4CFKE is in stock at multiple authorized distributors as of 2026-10-18. DigiKey lists ships-today availability, Heisener shows 9,240 pieces in inventory, and LCSC carries stock with $0.7065 unit pricing. NXP's product page flags the part as End-of-Life (EOL) pending replacement, so current production orders should confirm lifecycle status with NXP before committing to long-running programs.
What is the lead time for MC9S08QG4CFKE orders?
Lead time for the MC9S08QG4CFKE is typically ships-today from distributor stock, per DigiKey's product page as of 2026-10-18. Heisener indicates in-stock quantity of 9,240 pieces available for immediate shipment. For production-volume orders beyond distributor stock, consult NXP directly because the part is listed under End-of-Life transition, which may affect long-term availability.
What can replace the MC9S08QG4CFKE in a 24-QFN design?
Direct pin-compatible drop-in replacements within the S08QG family include the MC9S08QG4CFFER (24-QFN, same peripherals and Flash) and MC9S08QG4CFQE variants, both sourced from the NXP cross-reference data. These are same-package, pin-to-pin compatible parts preserving firmware, schematics, and PCB layout. For non-NXP alternatives, evaluate Microchip PIC16F comparable 8-bit MCUs in similar QFN packages, though these require firmware porting and review of pinout compatibility.
What is the best cross-brand equivalent for the MC9S08QG4CFKE?
The best cross-brand equivalent for the MC9S08QG4CFKE comes from the Microchip PIC16F family, specifically PIC16F18424 or PIC16F15313 variants in compatible small-form-factor packages. These parts share 8-bit architecture, Flash memory, and integrated ADC functionality; however, the PIC family uses a different instruction set and toolchain, so firmware must be rewritten. They serve as functional equivalents for non-NXP second-source strategies.
What is the difference between MC9S08QG4CFKE and MC9S08QG4CPAE?
Both are S08QG family members with the same 4KB Flash and 20MHz core, but they differ in package: the MC9S08QG4CFKE ships in a 24-QFN-EP (4x4 mm) while the MC9S08QG4CPAE uses a 16-pin DIP or 16-TSSOP footprint. They are not drop-in interchangeable because the pinouts and pin counts differ; choose based on PCB space constraints and assembly preference.
When should I choose MC9S08QG4CFKE over a 32-bit MCU?
Choose the MC9S08QG4CFKE when 4 KB Flash and 8-bit CPU throughput are sufficient and BOM cost or power budget dominate over absolute performance. Typical fit cases include remote controls, simple sensor nodes, and appliance user-interface controllers. Move to a 32-bit MCU (e.g., Kinetis, STM32, or PIC32) if the application needs USB, complex communication stacks, DSP, or more than 64 KB of code space.
What is the pinout of the MC9S08QG4CFKE?
The MC9S08QG4CFKE pinout is documented in the S08QG family reference manual and the device datasheet PDF available from NXP's product page at https://www.nxp.com/part/MC9S08QG4CFKE. The 24-QFN-EP package maps power, ground, reset, BDM, and GPIO functions across pins 1 through 24, with the exposed thermal pad on the bottom serving as the primary thermal and ground connection. Refer to the official PDF for the exact pin-function table.
What is the difference between MC9S08QG4CFKE and MC9S08QG4CFQE?
Both MC9S08QG4CFKE and MC9S08QG4CFQE are members of the S08QG family with the same 4KB Flash and 20MHz core, distinguished mainly by their package options and minor peripheral feature sets. They share the same S08 instruction set and BDM debug interface. Consult the NXP cross-reference data to confirm whether the specific peripheral mix (ADC channels, timer count) matches before substituting them in production designs.

Engineering reference data for MC9S08QG4CFKE — comparison, design guidance, and compliance information.

Selection Guide

Choose MC9S08QG4CFKE when you need a low-cost, low-power 8-bit MCU in a 4x4 mm QFN-EP footprint for designs running from 1.8V to 3.6V supply with up to 4KB of Flash code space. Pick MC9S08QG8CFKE for the same footprint but with 8KB Flash if future firmware growth is expected. Choose MC9S08QG4CDTE (16-TSSOP) only if hand-prototyping or through-hole assembly is required, since it is not pin-to-pin compatible. For non-NXP second-source procurement, evaluate PIC16F18424 in equivalent QFN packages, accepting the firmware-rewrite cost and toolchain switch.

Comparison with Alternatives

Parameter This Product MC9S08QG4CFFER MC9S08QG4CFQE MC9S08QG4CFAE MC9S08QG8CFKE MC9S08QG4CDTE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 24-QFN-EP (4x4 mm) 24-QFN-EP (4x4 mm) - same 24-QFN-EP (4x4 mm) - same 24-QFN-EP (4x4 mm) - same 24-QFN-EP (4x4 mm) - same 16-TSSOP - different
Core HCS08 (8-bit) HCS08 (8-bit) HCS08 (8-bit) HCS08 (8-bit) HCS08 (8-bit) HCS08 (8-bit)
Maximum Clock 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Program Memory 4 KB Flash 4 KB Flash 4 KB Flash 4 KB Flash 8 KB Flash 4 KB Flash
Supply Voltage 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C

Key Differentiators

  • Same-package pin-compatible 8KB Flash upgrade (vs MC9S08QG8CFKE)
  • Lowest-cost 24-QFN S08QG option (vs MC9S08QG4CFFER)
  • Compact 4x4 mm form factor (vs MC9S08QG4CDTE)

Design Notes

Place a 100 nF decoupling capacitor as close as possible to each VDD pin and a single 4.7 uF bulk capacitor near the regulator output. The MC9S08QG4CFKE draws short current spikes during Flash programming and peripheral switching; inadequate decoupling may cause false resets on the BKGD or RESET pins. Star-ground the MCU VSS pins to the PCB ground plane with vias placed next to the exposed thermal pad.

Solder the exposed thermal pad of the 24-QFN-EP package to a continuous ground plane, ideally with a 4x4 array of thermal vias stitching to inner ground layers. The thermal pad doubles as the primary electrical reference and removes heat from the die during Flash programming. Avoid routing signal traces directly beneath the QFN body to keep the land pattern intact and prevent solder bridges during reflow.

Do not leave the RESET pin floating - tie it to VDD through a 10 kohm pull-up resistor with a 100 nF capacitor to ground for reset pulse generation. Floating reset pins are a primary cause of brown-out-style behaviour on S08 devices during power-up transients. Also confirm that the BKGD pin is pulled high during normal operation; an external BDM debugger overrides this only when actively driving the line.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per distributor listings. Operating temperature -40C to +85C is industrial grade; not AEC-Q100 qualified for automotive. Lifecycle flagged as End-of-Life pending replacement on NXP product page - confirm long-term availability before committing to high-volume production programs.

Data verified on: 2026-10-18 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

NXP Semiconductors MC9S08QG4CFKE MC9S08QG4CFFER MC9S08QG4CFQE MC9S08QG4CFAE MC9S08QG8CFKE MC9S08QG4CDTE S08QG family HCS08 core 8-bit microcontroller MCU Flash memory 24-QFN-EP QFN package RoHS Background Debug Mode (BDM) HC08 instruction set BGND instruction remote control application sensor node application appliance controller low-power MCU battery-powered electronics embedded processor
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