MC9S12D32MFUE vs MC9S12D64MFUER Comparison

Detailed side-by-side comparison of MC9S12D32MFUE by NXP Semiconductors and MC9S12D64MFUER by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12D32MFUE MC9S12D32MFUE - 16-Bit 25MHz HCS12 MCU | NXP | Automotive

MC9S12D32MFUE - 16-Bit 25MHz HCS12 MCU | NXP | Automotive

MC9S12D32MFUE Nrnd

Specification Comparison

Parameter MC9S12D32MFUE MC9S12D64MFUER
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $26.40 $1.05
Processor Core HCS12 —
Processor Series S12D —
Data Bus Width 16 bit —
Maximum Clock Frequency 25 MHz —
Program Memory Size 32 KB (32K x 8) 64 KB (64K x 8)
Program Memory Type Flash Flash
RAM Size 4K x 8 bytes —
EEPROM Size 1K x 8 bytes —
Number of I/O 59 59
Connectivity CANbus, I2C, SCI, SPI —
Peripherals PWM, WDT —
Operating Voltage 2.5 V / 5 V —
Package 80-QFP (14 x 14 mm) 80-QFP (14 x 14 mm), also called PQFP-80
Pin Count 80 pins —
Mounting Type Surface Mount Surface Mount (SMD/SMT)
Lifecycle Status NRND —
RoHS Not stated in verified data —
Core Architecture — HCS12 (16-bit CISC)
CPU Core — S12 CPU V2
Operating Frequency — 25 MHz
Supply Voltage — 2.5 V / 5 V
ADC — 2 x 10-bit, 8 channels each (16 ADC channels total)
PWM Channels — 8 channels
Capture/Compare Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC
Operating Temperature Range — -40 C to +125 C
Automotive Qualification — AEC-Q100
RoHS Status — Compliant
Packaging Method (tray / reel) — Tray
Approximate Weight — 0.033 oz (per supplier catalog)
Debug Interface — BDM (Background Debug Mode)
Watchdog / COP — Yes (COP reset, watchdog timer)

Datasheets & Resources

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