MC9S12DJ64MFUE vs MC9S12D64CPVE Comparison

Detailed side-by-side comparison of MC9S12DJ64MFUE by NXP Semiconductors and MC9S12D64CPVE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12DJ64MFUE MC9S12DJ64MFUE - HCS12 16-bit MCU 64KB Flash 80-QFP | NXP

MC9S12DJ64MFUE - HCS12 16-bit MCU 64KB Flash 80-QFP | NXP

MC9S12DJ64MFUE Nrnd

Specification Comparison

Parameter MC9S12DJ64MFUE MC9S12D64CPVE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $8.20 $11.50
Core Architecture HCS12 (CISC, 16-bit) —
CPU Frequency 25 MHz —
Program Memory 64 KB Flash (64K x 8) —
RAM Size 4 KB 4 KB (4K x 8)
EEPROM Size 1 KB 1 KB (1K x 8)
Data Flash (Emulation) 8 KB shared Flash region [DATA_NEEDED: confirmed address range] —
CAN Modules 2x msCAN 2.0 A/B —
SCI / SPI 2x SCI, 1x SPI —
ADC 8-channel, 10-bit 8-channel, 10-bit (x2 ATD modules)
Timers ECT (Enhanced Capture Timer), 16-bit, 8-channels —
PWM Channels 8 (4x 16-bit or 8x 8-bit via ECT) 8
GPIO Count [DATA_NEEDED: exact GPIO count per package] —
Operating Voltage 5 V (typical, 2.5 V for MCU core via internal regulator) [DATA_NEEDED: full min/max range] —
Operating Temperature -40C to +125C -40C to +85C (industrial)
Package Type 80-QFP (14x14 mm) —
Mounting Type Surface Mount Surface Mount
Debug Interface Background Debug Mode (BDM), single-wire —
RoHS Status Compliant —
Core Processor — HCS12
Core Size — 16-Bit
Architecture — CISC
Maximum CPU Frequency — 25 MHz
Program Memory Size — 64 KB (64K x 8) Flash
Number of I/O — 91
Supply Voltage — 2.5 V / 5 V
Connectivity — CANbus, I2C, SCI, SPI
Peripherals — PWM, WDT, ECT, ATD
Package — 112-LQFP (20x20 mm)
AEC-Q100 — Qualified (automotive)
Lead-Free / RoHS — Compliant per NXP product page

Datasheets & Resources

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