MC9S12DJ64MFUE vs MC9S12D64CPVE 对比

详细并排对比 MC9S12DJ64MFUE 出自 NXP Semiconductors 和 MC9S12D64CPVE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DJ64MFUE MC9S12DJ64MFUE - HCS12 16-bit MCU 64KB Flash 80-QFP | NXP

MC9S12DJ64MFUE - HCS12 16-bit MCU 64KB Flash 80-QFP | NXP

MC9S12DJ64MFUE Nrnd

规格对比

参数 MC9S12DJ64MFUE MC9S12D64CPVE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $8.20 $11.50
Core Architecture HCS12 (CISC, 16-bit) —
CPU Frequency 25 MHz —
Program Memory 64 KB Flash (64K x 8) —
RAM Size 4 KB 4 KB (4K x 8)
EEPROM Size 1 KB 1 KB (1K x 8)
Data Flash (Emulation) 8 KB shared Flash region [DATA_NEEDED: confirmed address range] —
CAN Modules 2x msCAN 2.0 A/B —
SCI / SPI 2x SCI, 1x SPI —
ADC 8-channel, 10-bit 8-channel, 10-bit (x2 ATD modules)
Timers ECT (Enhanced Capture Timer), 16-bit, 8-channels —
PWM Channels 8 (4x 16-bit or 8x 8-bit via ECT) 8
GPIO Count [DATA_NEEDED: exact GPIO count per package] —
Operating Voltage 5 V (typical, 2.5 V for MCU core via internal regulator) [DATA_NEEDED: full min/max range] —
工作温度 -40C to +125C -40C to +85C (industrial)
Package Type 80-QFP (14x14 mm) —
安装类型 Surface Mount Surface Mount
Debug Interface Background Debug Mode (BDM), single-wire —
RoHS 状态 Compliant —
Core Processor — HCS12
Core Size — 16-Bit
Architecture — CISC
Maximum CPU Frequency — 25 MHz
Program Memory Size — 64 KB (64K x 8) Flash
Number of I/O — 91
电源电压 — 2.5 V / 5 V
Connectivity — CANbus, I2C, SCI, SPI
Peripherals — PWM, WDT, ECT, ATD
封装 — 112-LQFP (20x20 mm)
AEC-Q100 — Qualified (automotive)
Lead-Free / RoHS — Compliant per NXP product page

数据手册与资源

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