MC9S12DT256MPVE vs MC9S12E256MPVE Comparison
Detailed side-by-side comparison of MC9S12DT256MPVE by NXP Semiconductors and MC9S12E256MPVE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndSpecification Comparison
| Parameter | MC9S12DT256MPVE | MC9S12E256MPVE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $14.36 | $18.20 |
| Core | HCS12 (16-bit CISC) | HCS12 |
| Maximum CPU Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | — |
| RAM | 12 KB | 16 KB |
| EEPROM | 4 KB | — |
| Data Bus Width | 16-bit | — |
| Supply Voltage | 2.35 V to 2.75 V (regulated core) | 5 V single rail (Vreg internal) |
| I/O Pins | 91 | — |
| ADC | 2 x 10-bit, 8 channels each (16 channels total) | 8-channel, 10-bit |
| Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) | — |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| Debug Interface | Background Debug Mode (BDM) + JTAG | — |
| RoHS Status | Compliant | — |
| Lifecycle Status | NRND (Not Recommended for New Designs) | — |
| Core Size | — | 16-bit |
| Maximum CPU Speed | — | 25 MHz |
| Program Memory | — | 256 KB Flash |
| Pin Count | — | 112 |
| SCI Modules | — | 3 (asynchronous serial) |
| SPI Modules | — | 1 |
| IIC Modules | — | 1 (Inter-IC Bus) |
| Timer Modules | — | 3 x 16-bit, 4-channel |
| PWM Channels | — | 6 |
| Connectivity | — | EBI/EMI, I2C, SPI, SCI |
| RoHS | — | [DATA_NEEDED: RoHS status] |