MC9S12GC16MFAE vs MC9S12C32MFAE16 Comparison

Detailed side-by-side comparison of MC9S12GC16MFAE by NXP Semiconductors and MC9S12C32MFAE16 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12GC16MFAE MC9S12GC16MFAE - 16KB Flash 16-Bit HCS12 MCU | NXP | 48-LQFP

MC9S12GC16MFAE - 16KB Flash 16-Bit HCS12 MCU | NXP | 48-LQFP

MC9S12GC16MFAE Obsolete
NXP Semiconductors
MC9S12C32MFAE16 MC9S12C32MFAE16 - HCS12 16-Bit MCU 32KB Flash LQFP-48 | NXP

MC9S12C32MFAE16 - HCS12 16-Bit MCU 32KB Flash LQFP-48 | NXP

MC9S12C32MFAE16 Nrnd

Specification Comparison

Parameter MC9S12GC16MFAE MC9S12C32MFAE16
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Obsolete NRND
Stock Status In Stock In Stock
Unit Price (USD) $4.10 $8.20
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series HCS12 / S12GC —
Core Processor HCS12 (16-bit CISC) —
Core Size 16-bit —
CPU Speed 25 MHz —
Program Memory Size 16 KB (16K x 8) —
Program Memory Type Flash —
RAM Size 1 KB (1K x 8) —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Number of I/O Pins 31 —
Supply Voltage 2.5 V / 5 V —
ADC 8-channel, 10-bit 8-channel, 10-bit
Connectivity EBI/EMI, SCI, SPI —
Peripherals POR, PWM, WDT —
Package 48-LQFP (7x7 mm, 0.5 mm pitch) 48-pin LQFP (7x7 mm)
Mounting Type Surface Mount Surface Mount
Operating Temperature Grade Automotive (per Partstack) —
Terminal Form / Pitch GULL WING / 0.5 mm —
Part Status Obsolete (per abc-semi listing) —
Core Architecture — HCS12 (16-bit CISC)
Family — S12C
Program Memory — 32 KB Flash
RAM — 2 KB
EEPROM — 1 KB
Bus Clock / CPU Frequency — 16 MHz
Supply Voltage (VDD) — 2.97 V to 5.5 V (5 V nominal, 2.5 V mode supported)
GPIO Count — Up to 38
Communication Interfaces — SCI (UART), SPI, I2C
Timers — Enhanced Capture Timer (ECT) + PWM channels
On-chip Voltage Regulator — Yes (bandgap-based VREG)
On-chip PLL — Yes
Debug Interface — Background Debug Mode (BDM)
Operating Temperature — -40 C to +85 C (automotive grade)
RoHS Status — [DATA_NEEDED: rohs status per part marking]

Datasheets & Resources

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