MC9S12GC16MFAE vs MC9S12C32MFAE16 Vergleich

Detaillierter Direktvergleich von MC9S12GC16MFAE von NXP Semiconductors und MC9S12C32MFAE16 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12GC16MFAE MC9S12GC16MFAE - 16KB Flash 16-Bit HCS12 MCU | NXP | 48-LQFP

MC9S12GC16MFAE - 16KB Flash 16-Bit HCS12 MCU | NXP | 48-LQFP

MC9S12GC16MFAE Obsolete
NXP Semiconductors
MC9S12C32MFAE16 MC9S12C32MFAE16 - HCS12 16-Bit MCU 32KB Flash LQFP-48 | NXP

MC9S12C32MFAE16 - HCS12 16-Bit MCU 32KB Flash LQFP-48 | NXP

MC9S12C32MFAE16 Nrnd

Spezifikationsvergleich

Parameter MC9S12GC16MFAE MC9S12C32MFAE16
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $4,10 $8,20
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series HCS12 / S12GC —
Core Processor HCS12 (16-bit CISC) —
Core Size 16-bit —
CPU Speed 25 MHz —
Program Memory Size 16 KB (16K x 8) —
Program Memory Type Flash —
RAM Size 1 KB (1K x 8) —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Number of I/O Pins 31 —
Versorgungsspannung 2.5 V / 5 V —
ADC 8-channel, 10-bit 8-channel, 10-bit
Connectivity EBI/EMI, SCI, SPI —
Peripherals POR, PWM, WDT —
Gehäuse 48-LQFP (7x7 mm, 0.5 mm pitch) 48-pin LQFP (7x7 mm)
Montageart Surface Mount Surface Mount
Operating Temperature Grade Automotive (per Partstack) —
Terminal Form / Pitch GULL WING / 0.5 mm —
Part Status Obsolete (per abc-semi listing) —
Core Architecture — HCS12 (16-bit CISC)
Family — S12C
Program Memory — 32 KB Flash
RAM — 2 KB
EEPROM — 1 KB
Bus Clock / CPU Frequency — 16 MHz
Supply Voltage (VDD) — 2.97 V to 5.5 V (5 V nominal, 2.5 V mode supported)
GPIO Count — Up to 38
Communication Interfaces — SCI (UART), SPI, I2C
Timers — Enhanced Capture Timer (ECT) + PWM channels
On-chip Voltage Regulator — Yes (bandgap-based VREG)
On-chip PLL — Yes
Debug Interface — Background Debug Mode (BDM)
Betriebstemperatur — -40 C to +85 C (automotive grade)
RoHS-Status — [DATA_NEEDED: rohs status per part marking]

Datenblätter & Ressourcen

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