MCF5280CVF80 vs MCF5280CVM80J Comparison
Detailed side-by-side comparison of MCF5280CVF80 by NXP Semiconductors and MCF5280CVM80J by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MCF5280CVF80 - Coldfire V2 32-bit MCU 80MHz 256-MAPBGA | NXP
MCF5280CVF80 ObsoleteSpecification Comparison
| Parameter | MCF5280CVF80 | MCF5280CVM80J |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10.95 | $9.10 |
| Core Processor | Coldfire V2 | ColdFire V2 |
| Core Size | 32-Bit | 32-Bit Single-Core |
| Core Speed | 80 MHz | — |
| Program Memory Type | ROMless | ROMless (external flash required) |
| Program Memory Size | Not populated (external memory interface required) | ROMless (0 KB internal flash, code via external bus) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | CANbus, Ethernet (10/100 MAC), I2C, SPI, UART |
| Number of I/O | 142 | [DATA_NEEDED: GPIO count from datasheet] |
| Peripherals | DMA, LVD, POR, PWM, WDT | DMA, PWM, WDT, 16-bit timers, external memory controller |
| Package Type | 256-MAPBGA | — |
| Package Dimensions | 17 x 17 mm | — |
| Operating Voltage | 3.3 V typical (ROMless ColdFire core) | — |
| Series | MCF528x | MCF528x (ColdFire V2) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL Level | [DATA_NEEDED: MSL level] | 3 (per JEDEC J-STD-020, typical for MAPBGA) |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (Pb-free reflow profile) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Maximum CPU Clock | — | 80 MHz |
| Package | — | 256-MAPBGA (17x17 mm) |
| Temperature Grade | — | Industrial |
| Operating Temperature | — | -40C to +105C (TJ, industrial grade) |
| Ethernet | — | 10/100 MAC integrated (MII/RMII interface to external PHY) |
| CAN | — | CAN 2.0 controller integrated |
| Debug Interface | — | JTAG / BDM (Background Debug Mode) |
| Lead-Free Finish | — | Yes (Matte Tin, SAC solder compatible) |