MCF5280CVF80 vs MCF5280CVM80J Vergleich

Detaillierter Direktvergleich von MCF5280CVF80 von NXP Semiconductors und MCF5280CVM80J von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCF5280CVF80 MCF5280CVF80 - Coldfire V2 32-bit MCU 80MHz 256-MAPBGA | NXP

MCF5280CVF80 - Coldfire V2 32-bit MCU 80MHz 256-MAPBGA | NXP

MCF5280CVF80 Obsolete
NXP Semiconductors
MCF5280CVM80J MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J Obsolete

Spezifikationsvergleich

Parameter MCF5280CVF80 MCF5280CVM80J
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $10,95 $9,10
Core Processor Coldfire V2 ColdFire V2
Core Size 32-Bit 32-Bit Single-Core
Core Speed 80 MHz —
Program Memory Type ROMless ROMless (external flash required)
Program Memory Size Not populated (external memory interface required) ROMless (0 KB internal flash, code via external bus)
Connectivity CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART CANbus, Ethernet (10/100 MAC), I2C, SPI, UART
Number of I/O 142 [DATA_NEEDED: GPIO count from datasheet]
Peripherals DMA, LVD, POR, PWM, WDT DMA, PWM, WDT, 16-bit timers, external memory controller
Package Type 256-MAPBGA —
Package Dimensions 17 x 17 mm —
Operating Voltage 3.3 V typical (ROMless ColdFire core) —
Series MCF528x MCF528x (ColdFire V2)
Montageart Surface Mount (BGA) Surface Mount (BGA)
MSL-Level [DATA_NEEDED: MSL level] 3 (per JEDEC J-STD-020, typical for MAPBGA)
RoHS-Status [DATA_NEEDED: RoHS status] Compliant (Pb-free reflow profile)
Manufacturer — NXP Semiconductors (formerly Freescale Semiconductor)
Maximum CPU Clock — 80 MHz
Gehäuse — 256-MAPBGA (17x17 mm)
Temperature Grade — Industrial
Betriebstemperatur — -40C to +105C (TJ, industrial grade)
Ethernet — 10/100 MAC integrated (MII/RMII interface to external PHY)
CAN — CAN 2.0 controller integrated
Debug Interface — JTAG / BDM (Background Debug Mode)
Lead-Free Finish — Yes (Matte Tin, SAC solder compatible)

Datenblätter & Ressourcen

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