MCF5282CVM80J vs MCF5280CVM80J Comparison

Detailed side-by-side comparison of MCF5282CVM80J by NXP Semiconductors and MCF5280CVM80J by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MCF5282CVM80J MCF5282CVM80J - 32-Bit ColdFire V2 MCU 512KB Flash | NXP

MCF5282CVM80J - 32-Bit ColdFire V2 MCU 512KB Flash | NXP

MCF5282CVM80J Obsolete
NXP Semiconductors
MCF5280CVM80J MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J Obsolete

Specification Comparison

Parameter MCF5282CVM80J MCF5280CVM80J
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $9.75 $9.10
Core Processor ColdFire V2 ColdFire V2
Core Size 32-Bit 32-Bit Single-Core
Maximum Clock Speed 80 MHz —
Program Memory Size 512 KB (512K x 8) ROMless (0 KB internal flash, code via external bus)
Program Memory Type FLASH ROMless (external flash required)
RAM Size 64 KB (64K x 8) —
Number of I/O 150 [DATA_NEEDED: GPIO count from datasheet]
Package / Case 256-MAPBGA (17x17) —
Connectivity CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART CANbus, Ethernet (10/100 MAC), I2C, SPI, UART
Peripherals DMA, LVD, POR, PWM, WDT DMA, PWM, WDT, 16-bit timers, external memory controller
Ethernet 10/100 MAC with MII 10/100 MAC integrated (MII/RMII interface to external PHY)
CAN Controllers 2 x CAN 2.0B —
Oscillator Type External —
Mounting Type Surface Mount Surface Mount (BGA)
Packaging Tray —
Operating Temperature -40C to +85C -40C to +105C (TJ, industrial grade)
RoHS Status Compliant Compliant (Pb-free reflow profile)
Lead-Free Yes —
Manufacturer — NXP Semiconductors (formerly Freescale Semiconductor)
Series — MCF528x (ColdFire V2)
Maximum CPU Clock — 80 MHz
Package — 256-MAPBGA (17x17 mm)
Temperature Grade — Industrial
CAN — CAN 2.0 controller integrated
Debug Interface — JTAG / BDM (Background Debug Mode)
MSL Level — 3 (per JEDEC J-STD-020, typical for MAPBGA)
Lead-Free Finish — Yes (Matte Tin, SAC solder compatible)

Datasheets & Resources

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