MCZ33903CP5EK vs MCZ33903BD3EK Comparison

Detailed side-by-side comparison of MCZ33903CP5EK by NXP Semiconductors and MCZ33903BD3EK by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MCZ33903CP5EK MCZ33903CP5EK - SBC Gen2 with Hi-Speed CAN, 32-SOIC EP | NXP

MCZ33903CP5EK - SBC Gen2 with Hi-Speed CAN, 32-SOIC EP | NXP

MCZ33903CP5EK ✗ End of Life
NXP Semiconductors
MCZ33903BD3EK MCZ33903BD3EK - SBC CAN HS 3.3V 32-SOIC EP | NXP

MCZ33903BD3EK - SBC CAN HS 3.3V 32-SOIC EP | NXP

MCZ33903BD3EK Obsolete

Specification Comparison

Parameter MCZ33903CP5EK MCZ33903BD3EK
Brand NXP Semiconductors NXP Semiconductors
Category Interface ICs Specialized Power ICs
Lifecycle Status End of Life Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $3.95 $4.10
Product Type System Basis Chip (SBC Gen2) System Basis Chip (SBC Gen2)
Integrated Function 5V/3.3V LDO + High-Speed CAN transceiver + 2x 5V/400 mA protected supplies —
CAN Standard ISO 11898-2 and ISO 11898-5 —
CAN Bus Speed (Normal/Sleep) 20 kbps —
Nominal Input Voltage 9V / 12V / 15V / 18V / 24V (automotive battery rails) —
MCU Supply Voltage 5.0 V or 3.3 V selectable —
Auxiliary Regulator Outputs (V1, V2) 2 x 5.0 V / 400 mA —
Embedded VDD Regulator Fully-protected 5.0 V LDO (external PNP option for current extension) —
Protection Features Voltage, current, temperature; bus failure diagnostics —
Low-Power Mode Quiescent Current Extremely low (per datasheet low-power specs) —
Interface SPI control / diagnostics —
Operating Temperature Grade Automotive (AEC-Q100) —
Package 32-pin SOIC Wide-Body with Exposed Pad (SOIC-32 EP) —
Mounting Type Surface Mount Surface Mount
Shipping Carrier Tube (per Freescale/NXP original part marking) —
Compliance AEC-Q100 qualified, automotive grade —
Manufacturer — NXP Semiconductors (formerly Freescale)
Supply Voltage (VCC) — 5.5 V to 28 V
Auxiliary Regulator Output — 3.3 V
CAN Interface — High-Speed CAN, Normal/Sleep modes, ISO 11898
LIN Interface — LIN 2.x physical layer
Package / Case — 32-SSOP Exposed Pad (7.50 mm body width)
Supplier Device Package — 32-SOIC EP
Operating Temperature — -40C to +125C (automotive AEC-Q100 grade [DATA_NEEDED: specific grade])
SPI Control Interface — Yes (configuration, diagnostics, watchdog)
Status / Lifecycle — End-of-Life / Obsolete per NXP product page
Lead-Free Status — [DATA_NEEDED: confirm per lot]
RoHS Status — [DATA_NEEDED: confirm per lot]
Original Packaging — Tube

Datasheets & Resources

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