MCZ33903CP5EK vs MCZ33903BD3EK Vergleich
Detaillierter Direktvergleich von MCZ33903CP5EK von NXP Semiconductors und MCZ33903BD3EK von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCZ33903CP5EK - SBC Gen2 with Hi-Speed CAN, 32-SOIC EP | NXP
MCZ33903CP5EK ✗ Abgekündigt
Spezifikationsvergleich
| Parameter | MCZ33903CP5EK | MCZ33903BD3EK |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Interface ICs | Specialized Power ICs |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,95 | $4,10 |
| Product Type | System Basis Chip (SBC Gen2) | System Basis Chip (SBC Gen2) |
| Integrated Function | 5V/3.3V LDO + High-Speed CAN transceiver + 2x 5V/400 mA protected supplies | — |
| CAN Standard | ISO 11898-2 and ISO 11898-5 | — |
| CAN Bus Speed (Normal/Sleep) | 20 kbps | — |
| Nominal Input Voltage | 9V / 12V / 15V / 18V / 24V (automotive battery rails) | — |
| MCU Supply Voltage | 5.0 V or 3.3 V selectable | — |
| Auxiliary Regulator Outputs (V1, V2) | 2 x 5.0 V / 400 mA | — |
| Embedded VDD Regulator | Fully-protected 5.0 V LDO (external PNP option for current extension) | — |
| Protection Features | Voltage, current, temperature; bus failure diagnostics | — |
| Low-Power Mode Quiescent Current | Extremely low (per datasheet low-power specs) | — |
| Schnittstelle | SPI control / diagnostics | — |
| Operating Temperature Grade | Automotive (AEC-Q100) | — |
| Gehäuse | 32-pin SOIC Wide-Body with Exposed Pad (SOIC-32 EP) | — |
| Montageart | Surface Mount | Surface Mount |
| Shipping Carrier | Tube (per Freescale/NXP original part marking) | — |
| Compliance | AEC-Q100 qualified, automotive grade | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Supply Voltage (VCC) | — | 5.5 V to 28 V |
| Auxiliary Regulator Output | — | 3.3 V |
| CAN Interface | — | High-Speed CAN, Normal/Sleep modes, ISO 11898 |
| LIN Interface | — | LIN 2.x physical layer |
| Gehäuse / Bauform | — | 32-SSOP Exposed Pad (7.50 mm body width) |
| Supplier Device Package | — | 32-SOIC EP |
| Betriebstemperatur | — | -40C to +125C (automotive AEC-Q100 grade [DATA_NEEDED: specific grade]) |
| SPI Control Interface | — | Yes (configuration, diagnostics, watchdog) |
| Status / Lifecycle | — | End-of-Life / Obsolete per NXP product page |
| Lead-Free Status | — | [DATA_NEEDED: confirm per lot] |
| RoHS-Status | — | [DATA_NEEDED: confirm per lot] |
| Original Packaging | — | Tube |