MPC566AZP56 vs MPCZ565MVR56 Comparison
Detailed side-by-side comparison of MPC566AZP56 by NXP Semiconductors and MPCZ565MVR56 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP
MPCZ565MVR56 ObsoleteSpecification Comparison
| Parameter | MPC566AZP56 | MPCZ565MVR56 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $169.59 | $52.75 |
| Family | Qorivva (MPC5xx) | — |
| Core | PowerPC Power Architecture with FPU + BCC | — |
| Data Bus Width | 32-bit | 32-bit |
| Program Memory Size | 1 MB (1M x 8) FLASH | 1 MB Flash |
| RAM Size | 36 KB | 64 KB [DATA_NEEDED: exact value] |
| Maximum Clock Frequency | 56 MHz | 40 MHz |
| Operating Temperature Range | -55 C to +125 C (Automotive Grade) | -40C to +125C |
| Package Type | 388-PBGA (27x27 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Automotive Grade | Yes | Yes |
| Code Compression | Yes (Code compression, optimized for non-cached automotive code) | — |
| FPU | Dual precision floating-point unit | — |
| Lead Free / RoHS Status | [DATA_NEEDED: lead free status] | — |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Supply Voltage Range | [DATA_NEEDED: Vcc range] | [DATA_NEEDED: Vdd/Vdd range] |
| Peripherals | [DATA_NEEDED: peripheral set (CAN, SPI, SCI, etc.)] | — |
| Number of I/Os | [DATA_NEEDED: GPIO count] | — |
| Core Architecture | — | Power Architecture (MPC500 family) |
| Package / Case | — | 388-ball PBGA |
| Number of I/O Pins | — | [DATA_NEEDED: exact I/O count] |
| Floating Point Unit | — | Yes (IEEE 754) |
| CAN Controllers | — | 2 (CAN 2.0B) |
| ADC Channels | — | 40 (QADC) |
| Timers | — | 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] |
| Debug Interface | — | JTAG / OnCE / BDM |
| Moisture Sensitivity Level (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260C (40s max) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Process Technology | — | 0.25 micron CMOS |