MPC566AZP56 vs MPCZ565MVR56 Vergleich
Detaillierter Direktvergleich von MPC566AZP56 von NXP Semiconductors und MPCZ565MVR56 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP
MPCZ565MVR56 ObsoleteSpezifikationsvergleich
| Parameter | MPC566AZP56 | MPCZ565MVR56 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $169,59 | $52,75 |
| Family | Qorivva (MPC5xx) | — |
| Core | PowerPC Power Architecture with FPU + BCC | — |
| Datenbusbreite | 32-bit | 32-bit |
| Program Memory Size | 1 MB (1M x 8) FLASH | 1 MB Flash |
| RAM Size | 36 KB | 64 KB [DATA_NEEDED: exact value] |
| Maximale Taktfrequenz | 56 MHz | 40 MHz |
| Betriebstemperaturbereich | -55 C to +125 C (Automotive Grade) | -40C to +125C |
| Package Type | 388-PBGA (27x27 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Automotive Grade | Yes | Yes |
| Code Compression | Yes (Code compression, optimized for non-cached automotive code) | — |
| FPU | Dual precision floating-point unit | — |
| Lead Free / RoHS Status | [DATA_NEEDED: lead free status] | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Supply Voltage Range | [DATA_NEEDED: Vcc range] | [DATA_NEEDED: Vdd/Vdd range] |
| Peripherals | [DATA_NEEDED: peripheral set (CAN, SPI, SCI, etc.)] | — |
| Number of I/Os | [DATA_NEEDED: GPIO count] | — |
| Core Architecture | — | Power Architecture (MPC500 family) |
| Gehäuse / Bauform | — | 388-ball PBGA |
| Number of I/O Pins | — | [DATA_NEEDED: exact I/O count] |
| Floating Point Unit | — | Yes (IEEE 754) |
| CAN Controllers | — | 2 (CAN 2.0B) |
| ADC Channels | — | 40 (QADC) |
| Timers | — | 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] |
| Debug Interface | — | JTAG / OnCE / BDM |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260C (40s max) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Process Technology | — | 0.25 micron CMOS |