MPC755BVT300LE vs MPC745BVT300LE Comparison

Detailed side-by-side comparison of MPC755BVT300LE by NXP Semiconductors and MPC745BVT300LE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC745BVT300LE MPC745BVT300LE - PowerPC MPU 300MHz 32-Bit 255-FCPBGA | NXP

MPC745BVT300LE - PowerPC MPU 300MHz 32-Bit 255-FCPBGA | NXP

MPC745BVT300LE Nrnd

Specification Comparison

Parameter MPC755BVT300LE MPC745BVT300LE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Manufacturer NXP Semiconductors (formerly Freescale) —
Product Family MPC7xx (PowerPC) —
Architecture RISC, PowerPC —
Core Count 1 —
Data Bus Width 64-bit —
Instruction Width 32-bit —
Maximum Clock Frequency 300 MHz —
Supply Voltage 2 V / 2.5 V / 3.3 V —
Package Type FCBGA (Flip-Chip BGA) —
Pin/Ball Count 360 —
Package Dimensions 25 x 25 mm —
Ball Pitch 1.27 mm —
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature 0C to +105C —
Lead-Free / RoHS Lead-free, RoHS compliant —
L1 Cache Integrated (instruction + data) —
MMU Yes (demand-paged virtual memory) —
Power Modes Nap, Doze, Sleep —
Tray Packaging Yes (per Arrow listing) —
Family — MPC7xx (PowerPC G4)
Core Architecture — PowerPC Book E, 32-bit
Core Clock Speed — 300 MHz
Process Technology — 0.18 micrometer CMOS
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Cache Interface — External (cache-as-RAM supported)
External Data Bus Width — 64-bit
Address Bus Width — 32-bit
Core Supply Voltage (Vdd) — 1.55 V to 1.65 V (1.6 V nominal)
I/O Supply Voltage (Vdd_IO) — 3.135 V to 3.465 V (3.3 V nominal)
Operating Temperature (TA) — 0C to 105C
Package — 255-FCPBGA (21x21 mm)
MSL Level — [DATA_NEEDED: MSL rating]
JTAG / Debug Port — IEEE 1149.1 JTAG + COP
Endianness — Big-endian and Little-endian (selectable)
RoHS Status — [DATA_NEEDED: per datasheet]

Datasheets & Resources

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