MPC8265AVVPIBC vs MPC8250AVVPIBC Comparison
Detailed side-by-side comparison of MPC8265AVVPIBC by NXP Semiconductors and MPC8250AVVPIBC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8250AVVPIBC - PowerQUICC II 300MHz MPU | NXP 480-TBGA
MPC8250AVVPIBC ⚠ Last Time BuySpecification Comparison
| Parameter | MPC8265AVVPIBC | MPC8250AVVPIBC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $167.59 | $108.90 |
| Manufacturer | NXP USA Inc. | — |
| Series | MPC82xx | MPC82xx (PowerQUICC II) |
| Core Processor | PowerPC G2 | — |
| Number of Cores | 1 | 1 |
| Bus Width | 32-Bit | — |
| Speed (Clock) | 300 MHz | — |
| Co-Processors / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | No | — |
| Ethernet | 10/100 Mbps (2x MAC) | — |
| USB | No | — |
| SATA | No | — |
| PCI | Yes (PCI bridge) | — |
| Operating Voltage | 3.3 V (core/IO); 2.0 V internal | — |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS |
| Operating Temperature | -40C to +85C (industrial) | 0C to +105C |
| Package / Case | 480-TBGA (37.5 x 37.5 mm) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS Status | Compliant | Non-Compliant (NO-PB marking) |
| Part Status | Not For New Designs (NRND) | — |
| Core Architecture | — | PowerPC G2 |
| Data Bus Width | — | 32-Bit |
| Core Frequency | — | 300 MHz |
| Supply Voltage | — | 3.3 V |
| Package | — | 480-TBGA (37.5 x 37.5 mm) |
| Pin Count | — | 480 |
| Communications Processor Module | — | Integrated CPM |
| External Bus Speed | — | Up to 133 MHz |
| Memory Controller | — | SDRAM / Flash / ROM |