MPC8265AVVPIBC - 300MHz PowerQUICC II MPU, 480-TBGA | NXP
MPN: MPC8265AVVPIBC ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $241.67 | $241.67 |
| 10 | $219.7 | $2,197.00 |
| 100 | $192.74 | $19,274.00 |
| 500 | $178.13 | $89,065.00 |
| 1,000 | $167.59 | $167,590.00 |
MPC8265AVVPIBC Overview
What is a PowerQUICC II processor? The PowerQUICC II family (MPC82xx) is a line of integrated communications processors that combine a PowerPC execution core with the CPM (Communications Processor Module), a dedicated RISC engine for offloading serial communications tasks such as ATM, Ethernet, HDLC, TDM, and UART. The family sits at the hierarchy: MPU -> microprocessor -> embedded processor -> communications processor -> PowerQUICC II. Compared with a generic MCU, a PowerQUICC II integrates DMA engines, ATM segmentation and reassembly, and multi-channel serial interfaces directly, making it a system-on-chip for routers, DSLAMs, and base-station controllers.
Key features of the MPC8265AVVPIBC include: PowerPC G2 core, 300 MHz operation, integrated CPM, 32-bit data path, support for DRAM and SDRAM memory controllers, and a 480-ball TBGA package. It also offers dual 10/100 Ethernet MACs, PCI bridge, multiple serial communication controllers, and an interrupt controller for real-time system responsiveness. The 'V' suffix indicates a specific speed grade and 'IBC' indicates a particular silicon revision and ordering code per NXP naming convention.
Architecture: the chip uses a 0.25um CMOS process with on-chip caches, separate instruction and data MMUs, and a unified 64-bit system bus. The CPM provides 32-bit RISC processing for communication channels, leaving the PowerPC core free for higher-level protocol stacks. Memory support includes DRAM, SDRAM, ROM, Flash, and burst SRAM, with programmable chip-select outputs.
Typical applications include wired networking equipment (routers, switches, DSLAMs), wireless base stations, telecom line cards, industrial control with Ethernet, and legacy embedded computing systems. It is also found in imaging and printing subsystems where the CPM offloads I/O from the host CPU. Choose the MPC8265AVVPIBC when you need a proven 32-bit communications MPU with deterministic serial performance.
Design consideration: pay close attention to power sequencing between the 3.3V and 2.0V rails, ensure the JTAG pins are accessible for boundary-scan debugging, and use controlled-impedance traces for the 60x bus. The BGA package requires X-ray inspection or proper reflow profiling during assembly.
This page synthesizes distributor pricing for the MPC8265AVVPIBC, side-by-side comparison against same-family MPC8265 variants, drop-in alternatives, and practical design notes that complement the NXP MPC8260A PowerQUICC II Hardware Specifications document.
Drop-in alternatives for MPC8265AVVPIBC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8265AVVPIBC (same form factor and footprint) — differing in Operating Temperature, Process Technology, Mounting Type, Number of Cores, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8265AVVPBC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8265AVVPIBC-R
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8260AVVPIBC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8264AVVPIBC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8250AVVPIBC
✅ Drop-In✓ In Stock
$108.9 / Unit
View Datasheet →MPC8250AZUPIBC
✅ Drop-In✓ In Stock
$110.25 / Unit
View Datasheet →MPC8265AVVPIBC Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP USA Inc. |
| Series | MPC82xx |
| Core Processor | PowerPC G2 |
| Number of Cores | 1 |
| Bus Width | 32-Bit |
| Speed (Clock) | 300 MHz |
| Co-Processors / DSP | Communications; RISC CPM |
| RAM Controllers | DRAM, SDRAM |
| Graphics Acceleration | No |
| Display & Interface Controllers | No |
| Ethernet | 10/100 Mbps (2x MAC) |
| USB | No |
| SATA | No |
| PCI | Yes (PCI bridge) |
| Operating Voltage | 3.3 V (core/IO); 2.0 V internal |
| Process Technology | 0.25 um CMOS |
| Operating Temperature | -40C to +85C (industrial) |
| Package / Case | 480-TBGA (37.5 x 37.5 mm) |
| Mounting Type | Surface Mount (BGA) |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS Status | Compliant |
| Part Status | Not For New Designs (NRND) |
MPC8265AVVPIBC 480-tbga (37.5 x 37.5 mm) Pin Configuration Guide
Pin configuration for MPC8265AVVPIBC (480-tbga (37.5 x 37.5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8265AVVPIBC.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8265AVVPIBC is suitable for 6 applications: Wired Networking Routers, Telecom Line Cards, Wireless Base Station Controllers, Industrial Ethernet Equipment, Printers and Imaging Systems, Legacy Embedded Computing.
Wired Networking Routers
The MPC8265AVVPIBC is widely deployed in wired routers and access concentrators where its integrated dual 10/100 Ethernet MACs, PCI bridge, and CPM offload significantly reduce BOM cost. The 300 MHz PowerPC G2 core handles routing tables and control-plane protocols at line rate, while the RISC CPM engine independently manages serial and Ethernet DMA, freeing the host CPU. The 32-bit data path and 64-bit 60x system bus sustain gigabit-aggregate throughput across multiple ports, making the part a workhorse for SMB router and gateway designs.
Recommended
Telecom Line Cards
In telecom line cards for DSLAMs and TDM switches, the MPC8265AVVPIBC's multi-channel serial communication controllers and ATM segmentation/reassembly hardware provide deterministic latency for voice and DSL traffic. The CPM's independent RISC engine manages T1/E1, HDLC, and ATM channels without host intervention, reducing jitter to single-digit microseconds. Combined with the 480-TBGA's thermal capacity, the device fits line-card form factors with industrial-grade temperature support.
Recommended
Wireless Base Station Controllers
Legacy 2G/3G base station controllers use the MPC8265AVVPIBC to manage Abis and lub interfaces, where the chip's CPM handles E1/T1 framing, HDLC, and ATM AAL2 segmentation in hardware. The PowerPC G2 core runs the Layer 2/3 protocol stack at 300 MHz, comfortably sustaining typical 2G BSC workloads. Industrial temperature grade (-40C to +85C) and proven long-term availability through Rochester Electronics make it suitable for carrier-grade deployments.
Recommended
Industrial Ethernet Equipment
The MPC8265AVVPIBC powers industrial Ethernet gateways, protocol converters, and remote telemetry units requiring deterministic real-time networking. The integrated dual 10/100 MACs support copper and fiber PHYs, while the PCI bus interfaces to FPGA co-processors for deterministic I/O expansion. The industrial temperature range and lead-free 480-TBGA package suit factory-floor deployments with extended lifecycle support.
Recommended
Printers and Imaging Systems
High-end network printers and multifunction imaging systems use the MPC8265AVVPIBC for its integrated Ethernet, PCI expansion, and high-throughput DMA. The CPM's serial channels drive scanner and print-engine interfaces while the PowerPC core handles rendering, job queuing, and network protocols. The 480-TBGA package fits compact controller boards with high-density BGA assembly.
Recommended
Legacy Embedded Computing
Long-lifecycle embedded systems in defense, aerospace, and industrial automation use the MPC8265AVVPIBC where software stability, deterministic behavior, and 15+ year product support outweigh the need for newer features. The PowerPC G2 architecture, VxWorks and Linux support, and 480-TBGA ruggedized design make it a preferred choice for ruggedized SBCs and ATR chassis systems requiring MIL-STD-810 compliance.
Recommended
Recommended Products Summary
Engineering reference data for MPC8265AVVPIBC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8265AVVPBC | MPC8265AVVPIBC-R | MPC8260AVVPIBC | MPC8264AVVPIBC | MPC8250AVVPIBC | MPC8250AZUPIBC |
|---|---|---|---|---|---|---|---|
| Package | 480-TBGA (37.5x37.5 mm) | 480-TBGA - same | 480-TBGA - same | 480-TBGA - same | 480-TBGA - same | 480-TBGA - same | 480-TBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Core Processor | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 |
| Temperature Grade | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Ethernet MACs | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 1x 10/100 Mbps (reduced) | 2x 10/100 Mbps | 1x 10/100 Mbps (reduced) | 1x 10/100 Mbps (reduced) |
| Packaging Form | Tray | Tray | Tape & Reel | Tray | Tray | Tray | Tray |
| CPM Channels | Full set (FCCs + SCCs) | Full set | Full set | Reduced set | Mid set | Reduced set | Reduced set |
Key Differentiators
- Full-feature CPM with dual Ethernet MACs (vs MPC8250AVVPIBC)
- Industrial temperature grade standard (vs MPC8265AVVPBC)
- Tier-up within the same family (vs MPC8264AVVPIBC)
Design Notes
The MPC8265AVVPIBC requires careful power sequencing: the 2.0V core rail must ramp before or simultaneously with the 3.3V I/O rail to prevent latch-up. Use a dual-output switching regulator with PG (power-good) signals tied to the PORESET pin via a supervisor circuit. Decoupling: place 0.1uF X7R ceramics at every power pin cluster, plus bulk 10uF tantalum or polymer caps near the package. Estimated: total decoupling budget should be ~100uF across the board for the 480-TBGA's power-pin distribution.
The 480-TBGA package requires thermal vias under the die and adequate copper pour on inner and outer PCB layers. At 300 MHz with typical 1.5W dissipation, the junction-to-ambient thermal resistance (theta_JA) on a standard 4-layer PCB is approximately 18 C/W. For sealed enclosures without airflow, derate to 70% Tj max or use a heatsink attached to the top of the BGA. Industrial-grade parts are specified to +85C ambient with 50% duty-cycle thermal margin.
The 480-TBGA uses a 1.27 mm ball pitch - this demands laser-drilled or photo-defined micro-vias on a high-Tg FR-4 or BT substrate. Route signal escapes on inner micro-via layers, and fan out power and ground on dedicated planes. JTAG pins (TRST, TCK, TMS, TDI, TDO) must be brought to a header for boundary-scan and code debugging. Maintain 50 ohm controlled impedance for the 60x bus traces and clock distribution.
Common design mistakes: (1) forgetting to strap HRESET low during power-up until both rails are stable; (2) using the wrong boot configuration word - the BCH (Boot Configuration Half-word) defaults to a non-functional state if external pull-ups are not installed; (3) leaving the JTAG TRST pin floating, which causes spurious boundary-scan interrupts; (4) underestimating the bulk decoupling required on the 60x bus termination. Reference the NXP MPC8260A Hardware Specifications document section on reset and boot configuration for full details.
Compliance Information
RoHS compliant and lead-free per NXP product page and DigiKey listing. Not AEC-Q100 qualified (industrial/communications MPU, not automotive). REACH compliance assumed per NXP product family policy.