MPC8347ECVRADDB vs MPC8343CZQADDB Comparison

Detailed side-by-side comparison of MPC8347ECVRADDB by NXP Semiconductors and MPC8343CZQADDB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8347ECVRADDB MPC8347ECVRADDB - PowerQUICC II Pro 266MHz SoC, 620-HBGA | NXP

MPC8347ECVRADDB - PowerQUICC II Pro 266MHz SoC, 620-HBGA | NXP

MPC8347ECVRADDB ⚠ Last Time Buy
NXP Semiconductors
MPC8343CZQADDB MPC8343CZQADDB - PowerQUICC II Pro MPU, 266MHz, e300 | NXP

MPC8343CZQADDB - PowerQUICC II Pro MPU, 266MHz, e300 | NXP

MPC8343CZQADDB ✓ Active

Specification Comparison

Parameter MPC8347ECVRADDB MPC8343CZQADDB
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy Active
Core Architecture PowerPC e300 (32-bit) PowerPC e300
Core Frequency 266 MHz —
Instruction Set Power Architecture 32-bit —
L1 Cache (Instruction) 32 KB —
L1 Cache (Data) 32 KB —
Memory Controller DDR1/DDR2, up to 333 MHz DDR1/DDR2 with ECC
Ethernet Dual 10/100/1000 Mbps MAC 10/100/1000 (1 Gbit) via QUICC Engine
PCI Interface 32-bit, 33/66 MHz 32-bit, up to 66 MHz
USB 2x USB 2.0 Host with on-chip PHY USB 2.0 (on-chip)
Security Engine SEC 2.0 (DES/3DES/AES/SHA/RSA) —
DMA Channels 4 —
Operating Temperature -40C to +105C (Industrial) -40C to +105C (Industrial)
Package 620-HBGA Hi-CTE (29x29 mm) 620-ball HBGA (29x29 mm) - PBGA, exposed pad
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Lifecycle Status Last Time Buy (EOL announced) —
Manufacturer — NXP Semiconductors
Series — PowerQUICC II Pro
Number of Cores — 1
Data Bus Width — 32-bit
Maximum Clock Frequency — 266 MHz
Silicon Revision — 2.0
I2C — 2 channels
Supply Voltage — 1.8V core / 2.5V / 3.3V I/O

Datasheets & Resources

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