MPC8541ECPXALF vs MPC8541ECVTALF Comparison

Detailed side-by-side comparison of MPC8541ECPXALF by NXP Semiconductors and MPC8541ECVTALF by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8541ECPXALF MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF ✓ Active
NXP Semiconductors
MPC8541ECVTALF MPC8541ECVTALF - PowerQUICC III 667MHz MPU | 783-FCPBGA | NXP

MPC8541ECVTALF - PowerQUICC III 667MHz MPU | 783-FCPBGA | NXP

MPC8541ECVTALF ✓ Active

Specification Comparison

Parameter MPC8541ECPXALF MPC8541ECVTALF
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Core Architecture PowerPC e500 (Book-E enhanced) PowerPC e500
Maximum Core Frequency 667 MHz —
Data Bus Width 64-bit 32-bit
Instruction Set 32-bit Power Architecture —
L1 Instruction Cache 32 KB 32 KB
L1 Data Cache 32 KB 32 KB
L2 Cache 256 KB 256 KB unified
Core Supply Voltage 1.2 V (typical) 1.0 V
I/O Supply Voltage 3.3 V —
Ethernet Controllers 4x eTSEC (Gigabit) + 2x 10/100 Ethernet (FCC) —
Memory Controller DDR/DDR2 with ECC DDR/DDR2 with ECC
PCI Express PCIe x1 / x2 —
Security Engine SEC 3.0 (DES, 3DES, AES, SHA, MD5, RSA, Kasumi) DES/3DES, AES, SHA-1/256, MD-5, ARC-4
Package 783-FCBGA (29 x 29 mm, 1 mm pitch, flip chip) 783-FCPBGA (29x29 mm)
Operating Temperature -40C to +105C -40C to +105C (extended industrial, ALF grade)
Mounting Type Surface Mount Surface Mount
RoHS Compliance Compliant (lead-free) —
Manufacturer — NXP Semiconductors (formerly Freescale)
Series — PowerQUICC III, MPC85xx
Core Count — 1
Core Frequency — 667 MHz
I/O Voltage — 2.5 V / 3.3 V
Ethernet — Triple-Speed Ethernet (TSEC) with QoS
DMA Channels — 4
Compliance — RoHS [DATA_NEEDED: full status]

Datasheets & Resources

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