MPC8541ECPXALF vs MPC8541ECVTALF 对比
详细并排对比 MPC8541ECPXALF 出自 NXP Semiconductors 和 MPC8541ECVTALF 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP
MPC8541ECPXALF ✓ 量产中NXP Semiconductors
MPC8541ECVTALF - PowerQUICC III 667MHz MPU | 783-FCPBGA | NXP
MPC8541ECVTALF ✓ 量产中规格对比
| 参数 | MPC8541ECPXALF | MPC8541ECVTALF |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| Core Architecture | PowerPC e500 (Book-E enhanced) | PowerPC e500 |
| Maximum Core Frequency | 667 MHz | — |
| 数据总线宽度 | 64-bit | 32-bit |
| Instruction Set | 32-bit Power Architecture | — |
| L1 Instruction Cache | 32 KB | 32 KB |
| L1 Data Cache | 32 KB | 32 KB |
| L2 Cache | 256 KB | 256 KB unified |
| Core Supply Voltage | 1.2 V (typical) | 1.0 V |
| I/O Supply Voltage | 3.3 V | — |
| Ethernet Controllers | 4x eTSEC (Gigabit) + 2x 10/100 Ethernet (FCC) | — |
| Memory Controller | DDR/DDR2 with ECC | DDR/DDR2 with ECC |
| PCI Express | PCIe x1 / x2 | — |
| Security Engine | SEC 3.0 (DES, 3DES, AES, SHA, MD5, RSA, Kasumi) | DES/3DES, AES, SHA-1/256, MD-5, ARC-4 |
| 封装 | 783-FCBGA (29 x 29 mm, 1 mm pitch, flip chip) | 783-FCPBGA (29x29 mm) |
| 工作温度 | -40C to +105C | -40C to +105C (extended industrial, ALF grade) |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS Compliance | Compliant (lead-free) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | PowerQUICC III, MPC85xx |
| Core Count | — | 1 |
| Core Frequency | — | 667 MHz |
| I/O Voltage | — | 2.5 V / 3.3 V |
| Ethernet | — | Triple-Speed Ethernet (TSEC) with QoS |
| DMA Channels | — | 4 |
| Compliance | — | RoHS [DATA_NEEDED: full status] |