MPC860DTVR66D4 vs MPC860PZQ66D4 Comparison

Detailed side-by-side comparison of MPC860DTVR66D4 by NXP Semiconductors and MPC860PZQ66D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC860DTVR66D4 MPC860DTVR66D4 - PowerQUICC MPU 66MHz 357-PBGA | NXP

MPC860DTVR66D4 - PowerQUICC MPU 66MHz 357-PBGA | NXP

MPC860DTVR66D4 Nrnd
NXP Semiconductors
MPC860PZQ66D4 MPC860PZQ66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860PZQ66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860PZQ66D4 ✗ End of Life

Specification Comparison

Parameter MPC860DTVR66D4 MPC860PZQ66D4
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND End of Life
Stock Status In Stock In Stock
Unit Price (USD) $78.90 $102.02
Core Architecture PowerPC (MPC8xx) 32-bit PowerPC
Core Count 1 1
Data Bus Width 32-bit —
Max Core Frequency 66 MHz —
Operating Supply Voltage 3.3 V 3.3 V
Series MPC8xx / PowerQUICC PowerQUICC
Package / Case 357-BGA (PBGA, 25x25 mm) —
Mounting Type Surface Mount Surface Mount
Operating Temperature 0 C to +95 C -40C to +95C (industrial, per D4 revision)
Packaging Tray Tray
On-chip Peripherals CPM, ENET, ATM, HDLC, PCMCIA —
Ethernet 10 Mbps x2 —
Graphics Acceleration No —
Lead Free Status Lead Free —
RoHS Status RoHS Compliant Non-Compliant (Contains Lead)
Part Status Not For New Designs —
Processor Family — PowerQUICC MPC8xx
Maximum CPU Clock — 66 MHz
Package — 357-PBGA (25x25 mm)
Lead Status — Contains Lead (non-RoHS)
On-chip Communications Module — CPM with SCCs, SMCs, Ethernet, HDLC
Memory Controller — DRAM, SRAM, Flash, EPROM
Timers — 4 x 16-bit
Process Technology — 0.32 um CMOS
MSL Level — 3

Datasheets & Resources

Browse All Products Create BOM Request Quote