MPC870VR66-FR vs MPC875VR133 Comparison

Detailed side-by-side comparison of MPC870VR66-FR by NXP Semiconductors and MPC875VR133 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC870VR66-FR MPC870VR66-FR - 66MHz PowerQUICC MPC8xx 32-bit CPU | Freescale/NXP

MPC870VR66-FR - 66MHz PowerQUICC MPC8xx 32-bit CPU | Freescale/NXP

MPC870VR66-FR Obsolete
NXP Semiconductors
MPC875VR133 MPC875VR133 - PowerQUICC 133MHz 32-Bit MPU | NXP

MPC875VR133 - PowerQUICC 133MHz 32-Bit MPU | NXP

MPC875VR133 Obsolete

Specification Comparison

Parameter MPC870VR66-FR MPC875VR133
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Obsolete Obsolete
Manufacturer Freescale Semiconductor (now NXP Semiconductors) NXP Semiconductors (formerly Freescale Semiconductor)
Series PowerQUICC I, MPC8xx PowerQUICC, MPC8xx
Core Architecture Power Architecture, 32-bit Power Architecture (32-bit RISC)
Core Count 1 1
Core Frequency 66 MHz 133 MHz
I/O Supply Voltage 3.3 V —
Core Supply Voltage 1.7 V to 1.9 V —
Internal Cache 16 KB —
Package 256-PBGA (23x23 mm) —
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature 0 C to +95 C 0 °C to +95 °C
Packaging Option Tape and Reel ('-FR' suffix) —
Lead Free Status Lead Free —
RoHS Status RoHS Compliant [DATA_NEEDED: RoHS status]
Communications Processor Module (CPM) Integrated, multi-channel serial controller —
Performance — 176 MIPS
Data Bus Width — 32 bit
Process Technology — 0.18 µm CMOS
Supply Voltage (I/O) — 3.3 V
Package Type — 256-PBGA (HBGA), 23x23 mm
Terminal Pitch — 1.27 mm
On-chip Communications — CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII
Memory Controller — SDRAM, Flash, SRAM, ROM support
PCI Bridge — Integrated (PCI 2.1)
MSL Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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