MPC875VR80 vs MPC870VR80 Comparison

Detailed side-by-side comparison of MPC875VR80 by NXP Semiconductors and MPC870VR80 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC875VR80 MPC875VR80 - 80MHz 32-Bit PowerQUICC MPU | NXP

MPC875VR80 - 80MHz 32-Bit PowerQUICC MPU | NXP

MPC875VR80 Nrnd

Specification Comparison

Parameter MPC875VR80 MPC870VR80
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Obsolete
Processor Type MPC8xx communications microprocessor —
Core Architecture 32-bit Power Architecture PowerPC (MPC8xx)
Core Count 1 core —
Data Bus Width 32 bit 32 bit
Maximum Clock Frequency 80 MHz 80 MHz
Supply Voltage 3.3 V —
Process Technology 0.18 µm 0.18 µm CMOS
Package Type 256-ball PBGA (23 x 23 mm) —
Device Category Microprocessor (MPU) —
Operating Temperature 0°C to 95°C 0 °C to +95 °C (commercial)
Memory Management Memory-management units included —
Instruction Cache [DATA_NEEDED: instruction cache size] —
Data Cache [DATA_NEEDED: data cache size] —
External Memory Interface [DATA_NEEDED: external memory interface configuration] —
Maximum Operating Current [DATA_NEEDED: maximum operating current] —
Maximum Supply Voltage [DATA_NEEDED: maximum supply voltage] —
RoHS Status unknown [DATA_NEEDED: RoHS compliance status not in web data]
REACH Status unknown —
AEC-Q100 Qualification not_applicable —
Mounting Type Surface-mount BGA Surface Mount
Core/Processor Series — PowerQUICC MPC8xx
Number of Cores — 1
Address Bus Width — 32 bit
Instruction Set Architecture — Power Architecture (RISC)
On-Chip SRAM — 32 KB unified
I/O Voltage — 3.3 V
Core Voltage — 1.8 V
Package — 256-PBGA, 23 x 23 mm
Ethernet MAC — 10/100 Mbps integrated (Fast Ethernet)
Communications Processor Module (CPM) — Yes - HDLC, UART, transparent protocol support

Datasheets & Resources

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