MPC875VR80 vs MPC870VR80 Vergleich

Detaillierter Direktvergleich von MPC875VR80 von NXP Semiconductors und MPC870VR80 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC875VR80 MPC875VR80 - 80MHz 32-Bit PowerQUICC MPU | NXP

MPC875VR80 - 80MHz 32-Bit PowerQUICC MPU | NXP

MPC875VR80 Nrnd

Spezifikationsvergleich

Parameter MPC875VR80 MPC870VR80
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Obsolete
Processor Type MPC8xx communications microprocessor —
Core Architecture 32-bit Power Architecture PowerPC (MPC8xx)
Core Count 1 core —
Datenbusbreite 32 bit 32 bit
Maximale Taktfrequenz 80 MHz 80 MHz
Versorgungsspannung 3.3 V —
Process Technology 0.18 µm 0.18 µm CMOS
Package Type 256-ball PBGA (23 x 23 mm) —
Device Category Microprocessor (MPU) —
Betriebstemperatur 0°C to 95°C 0 °C to +95 °C (commercial)
Memory Management Memory-management units included —
Instruction Cache [DATA_NEEDED: instruction cache size] —
Data Cache [DATA_NEEDED: data cache size] —
External Memory Interface [DATA_NEEDED: external memory interface configuration] —
Maximum Operating Current [DATA_NEEDED: maximum operating current] —
Maximum Supply Voltage [DATA_NEEDED: maximum supply voltage] —
RoHS-Status unknown [DATA_NEEDED: RoHS compliance status not in web data]
REACH Status unknown —
AEC-Q100 Qualification not_applicable —
Montageart Surface-mount BGA Surface Mount
Core/Processor Series — PowerQUICC MPC8xx
Number of Cores — 1
Address Bus Width — 32 bit
Instruction Set Architecture — Power Architecture (RISC)
On-Chip SRAM — 32 KB unified
I/O Voltage — 3.3 V
Core Voltage — 1.8 V
Gehäuse — 256-PBGA, 23 x 23 mm
Ethernet MAC — 10/100 Mbps integrated (Fast Ethernet)
Communications Processor Module (CPM) — Yes - HDLC, UART, transparent protocol support

Datenblätter & Ressourcen

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