MPC875VR80 vs MPC875VR66 Comparison
Detailed side-by-side comparison of MPC875VR80 by NXP Semiconductors and MPC875VR66 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC875VR80 | MPC875VR66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Last Time Buy |
| Processor Type | MPC8xx communications microprocessor | — |
| Core Architecture | 32-bit Power Architecture | MPC8xx (PowerPC) - 32-bit |
| Core Count | 1 core | — |
| Data Bus Width | 32 bit | — |
| Maximum Clock Frequency | 80 MHz | — |
| Supply Voltage | 3.3 V | 3.3 V |
| Process Technology | 0.18 µm | 0.18 µm CMOS |
| Package Type | 256-ball PBGA (23 x 23 mm) | — |
| Device Category | Microprocessor (MPU) | — |
| Operating Temperature | 0°C to 95°C | 0 °C to +95 °C |
| Memory Management | Memory-management units included | — |
| Instruction Cache | [DATA_NEEDED: instruction cache size] | — |
| Data Cache | [DATA_NEEDED: data cache size] | — |
| External Memory Interface | [DATA_NEEDED: external memory interface configuration] | Yes - SDRAM / Flash / ROM (32-bit address bus) |
| Maximum Operating Current | [DATA_NEEDED: maximum operating current] | — |
| Maximum Supply Voltage | [DATA_NEEDED: maximum supply voltage] | — |
| RoHS Status | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | not_applicable | — |
| Mounting Type | Surface-mount BGA | Surface Mount |
| Product Type | — | Microprocessor (MPU) |
| Series | — | PowerQUICC MPC8xx |
| Core Clock Frequency | — | 66 MHz |
| Performance | — | 87 MIPS |
| Number of Cores | — | 1 |
| Package | — | 256-PBGA (23 x 23 mm) |
| Ball Pitch | — | 1.27 mm |
| Operating Mounting Type | — | Tray |
| Integrated Peripherals | — | CPM (Communications Processor Module), SCC, HDLC, UART, SPI |