MPC875VR80 vs MPC875VR66 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC875VR80 sa pamamagitan ng NXP Semiconductors at MPC875VR66 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP
MPC875VR66 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | MPC875VR80 | MPC875VR66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Processor Type | MPC8xx communications microprocessor | — |
| Core Architecture | 32-bit Power Architecture | MPC8xx (PowerPC) - 32-bit |
| Core Count | 1 core | — |
| Width ng Data Bus | 32 bit | — |
| Maksimum na Taktiko ng Oras | 80 MHz | — |
| Volte ng Pagbibigay | 3.3 V | 3.3 V |
| Process Technology | 0.18 µm | 0.18 µm CMOS |
| Package Type | 256-ball PBGA (23 x 23 mm) | — |
| Device Category | Microprocessor (MPU) | — |
| Temperature na Operasyon | 0°C to 95°C | 0 °C to +95 °C |
| Memory Management | Memory-management units included | — |
| Instruction Cache | [DATA_NEEDED: instruction cache size] | — |
| Data Cache | [DATA_NEEDED: data cache size] | — |
| External Memory Interface | [DATA_NEEDED: external memory interface configuration] | Yes - SDRAM / Flash / ROM (32-bit address bus) |
| Maximum Operating Current | [DATA_NEEDED: maximum operating current] | — |
| Maximum Supply Voltage | [DATA_NEEDED: maximum supply voltage] | — |
| Tindminan RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | not_applicable | — |
| Uri ng Pagpapasok | Surface-mount BGA | Surface Mount |
| Product Type | — | Microprocessor (MPU) |
| Series | — | PowerQUICC MPC8xx |
| Core Clock Frequency | — | 66 MHz |
| Performance | — | 87 MIPS |
| Number of Cores | — | 1 |
| Packhaging | — | 256-PBGA (23 x 23 mm) |
| Ball Pitch | — | 1.27 mm |
| Operating Mounting Type | — | Tray |
| Integrated Peripherals | — | CPM (Communications Processor Module), SCC, HDLC, UART, SPI |