MSC8156HAG1000B vs MSC8256SVT1000B Comparison

Detailed side-by-side comparison of MSC8156HAG1000B by NXP Semiconductors and MSC8256SVT1000B by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MSC8156HAG1000B MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B ✓ Active
NXP Semiconductors
MSC8256SVT1000B MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B Obsolete

Specification Comparison

Parameter MSC8156HAG1000B MSC8256SVT1000B
Brand NXP Semiconductors NXP Semiconductors
Category DSP DSP
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $198.75 $189.00
Product Type Multi-core Digital Signal Processor (DSP) —
DSP Cores 6 x StarCore SC3850 —
Core Clock Frequency 1 GHz per core —
On-chip RAM 576 KB (L1/L2 SRAM) —
On-chip ROM 96 KB —
Hardware Accelerator MAPLE-B (turbo/Viterbi FEC) —
External Memory Interface DDR2/DDR3 with ECC —
High-speed Serial Fabric 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 —
Ethernet 2 x Gigabit Ethernet (SGMII/RGMII) —
Queuing Engine Yes (QE for packet/traffic management) —
Peripheral Interfaces SPI, I2C, UART, PCI I2C, SPI, UART, GPIO
Process Technology CMOS —
Package 783-ball FCBGA (FCP-BGA), 29 x 29 mm 783-FCBGA (29x29 mm)
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature 0C to +105C -40C to +105C (industrial)
Peak Reflow Temperature 245C (JEDEC J-STD-020) —
Terminal Finish Tin Silver Copper (e1 per JESD-609) —
MSL Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
RoHS Status Compliant (per distributor datasheet listing) [DATA_NEEDED: RoHS status]
Manufacturer — NXP Semiconductors (formerly Freescale)
Series — StarCore MSC8256
Type — SC3850 Six-Core Digital Signal Processor
Core Architecture — StarCore SC3850 (VLE, 4-issue)
Number of Cores — 6
Core Clock Speed — 1 GHz
Aggregate Throughput — 1000 MIPS per core (6000 MIPS total)
Data Width — 32-bit / 64-bit
L1 Instruction Cache (per core) — 32 KB
L1 Data Cache (per core) — 32 KB
Unified L2 Cache (per core) — 512 KB (configurable to M2 memory in 64 KB increments)
On-Chip RAM (total) — 576 KB
Non-Volatile Memory (ROM) — 96 KB
MMU — Yes (hardware memory management unit)
EPIC (Interrupt Controller) — Yes (Extended Programmable Interrupt Controller)
Timers (per core) — 2 x 32-bit general-purpose
DDR Memory Controller — DDR2/DDR3 with ECC
High-Speed Interfaces — Serial RapidIO, PCI Express, SGMII, RGMII
Security Engine — SEC (cryptographic acceleration)

Datasheets & Resources

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