MSC8156HAG1000B vs MSC8256SVT1000B Vergleich
Detaillierter Direktvergleich von MSC8156HAG1000B von NXP Semiconductors und MSC8256SVT1000B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP
MSC8256SVT1000B ObsoleteSpezifikationsvergleich
| Parameter | MSC8156HAG1000B | MSC8256SVT1000B |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $198,75 | $189,00 |
| Product Type | Multi-core Digital Signal Processor (DSP) | — |
| DSP Cores | 6 x StarCore SC3850 | — |
| Core Clock Frequency | 1 GHz per core | — |
| On-chip RAM | 576 KB (L1/L2 SRAM) | — |
| On-chip ROM | 96 KB | — |
| Hardware Accelerator | MAPLE-B (turbo/Viterbi FEC) | — |
| External Memory Interface | DDR2/DDR3 with ECC | — |
| High-speed Serial Fabric | 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 | — |
| Ethernet | 2 x Gigabit Ethernet (SGMII/RGMII) | — |
| Queuing Engine | Yes (QE for packet/traffic management) | — |
| Peripheral Interfaces | SPI, I2C, UART, PCI | I2C, SPI, UART, GPIO |
| Process Technology | CMOS | — |
| Gehäuse | 783-ball FCBGA (FCP-BGA), 29 x 29 mm | 783-FCBGA (29x29 mm) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +105C | -40C to +105C (industrial) |
| Peak Reflow Temperature | 245C (JEDEC J-STD-020) | — |
| Terminal Finish | Tin Silver Copper (e1 per JESD-609) | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| RoHS-Status | Compliant (per distributor datasheet listing) | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | StarCore MSC8256 |
| Type | — | SC3850 Six-Core Digital Signal Processor |
| Core Architecture | — | StarCore SC3850 (VLE, 4-issue) |
| Number of Cores | — | 6 |
| Core Clock Speed | — | 1 GHz |
| Aggregate Throughput | — | 1000 MIPS per core (6000 MIPS total) |
| Data Width | — | 32-bit / 64-bit |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| Unified L2 Cache (per core) | — | 512 KB (configurable to M2 memory in 64 KB increments) |
| On-Chip RAM (total) | — | 576 KB |
| Non-Volatile Memory (ROM) | — | 96 KB |
| MMU | — | Yes (hardware memory management unit) |
| EPIC (Interrupt Controller) | — | Yes (Extended Programmable Interrupt Controller) |
| Timers (per core) | — | 2 x 32-bit general-purpose |
| DDR Memory Controller | — | DDR2/DDR3 with ECC |
| High-Speed Interfaces | — | Serial RapidIO, PCI Express, SGMII, RGMII |
| Security Engine | — | SEC (cryptographic acceleration) |