MSC8157TAG1000A vs MSC8251SVT1000B Comparison
Detailed side-by-side comparison of MSC8157TAG1000A by NXP Semiconductors and MSC8251SVT1000B by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP
MSC8157TAG1000A ⚠ Last Time BuySpecification Comparison
| Parameter | MSC8157TAG1000A | MSC8251SVT1000B |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | DSP | DSP |
| Lifecycle Status | Last Time Buy | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $178.00 | $65.00 |
| Device Type | Six-core Digital Signal Processor (DSP) | — |
| DSP Architecture | StarCore SC3850 (6x cores) | — |
| Core Frequency | 1 GHz per core | — |
| L1 Instruction Cache | 32 KB per core | 32 KB |
| L1 Data Cache | 32 KB per core | 32 KB |
| Unified L2 Cache | 512 KB (configurable as M2 in 64 KB increments) | — |
| Accelerator | MAPLE-B2 baseband accelerator | — |
| Memory Controller | Dual-channel DDR2/DDR3 with ECC | — |
| High-Speed Serial I/O | 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI | — |
| Package | 783-FCPBGA (29x29 mm) | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature | -40C to +105C | [DATA_NEEDED: operating temperature grade] |
| Supply Voltage | [DATA_NEEDED: core/IO voltage] | — |
| MMU | Yes | — |
| Interrupt Controller | EPIC (Extended Programmable Interrupt Controller) | — |
| Timers | 2x 32-bit general-purpose per core | — |
| RoHS Status | [DATA_NEEDED] | Compliant |
| MSL Level | [DATA_NEEDED] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Architecture | — | SC3850 StarCore, single core |
| Core Revision | — | StarCore R2.1 |
| Maximum Core Clock | — | 1 GHz |
| MIPS | — | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] |
| L2 Unified Cache | — | 512 KB (configurable, SRAM or MAP) |
| On-Chip RAM | — | 576 KB |
| Internal ROM | — | 96 KB |
| TDM Interfaces | — | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support |
| Ethernet MAC | — | Yes (integrated) |
| PCI Express | — | Yes (integrated controller) |
| Serial RapidIO | — | Yes (SERDES-based) |
| DMA Controller | — | Multi-channel DMA |
| Package Type | — | FCBGA (Flip-Chip Ball Grid Array) |
| Package Pin Count | — | 783 balls |
| Package Dimensions | — | 29 mm x 29 mm |
| Mounting Type | — | Surface Mount |
| Lead-Free / Halogen-Free | — | Yes (lead-free, halogen-free package) |